Inventor

NAGAHARA RONALD J

US20 patents

Patents

20 patents

US6168508B1Jan 2, 2001

Polishing pad surface for improved process control

LSI LOGIC CORP92 citations97

US5931719AAug 3, 1999

Method and apparatus for using pressure differentials through a polishing pad to improve performance in chemical mechanical polishing

LSI LOGIC CORP131 citations97

US6179956B1Jan 30, 2001

Method and apparatus for using across wafer back pressure differentials to influence the performance of chemical mechanical polishing

LSI LOGIC CORP57 citations96

US6531397B1Mar 11, 2003

Method and apparatus for using across wafer back pressure differentials to influence the performance of chemical mechanical polishing

LSI LOGIC CORP17 citations92

US6074288AJun 13, 2000

Modified carrier films to produce more uniformly polished substrate surfaces

LSI LOGIC CORP24 citations92

US5961375AOct 5, 1999

Shimming substrate holder assemblies to produce more uniformly polished substrate surfaces

LSI LOGIC CORP30 citations92

US5941761AAug 24, 1999

Shaping polishing pad to control material removal rate selectively

LSI LOGIC CORP37 citations92

US6503828B1Jan 7, 2003

Process for selective polishing of metal-filled trenches of integrated circuit structures

LSI LOGIC CORP21 citations91

US6417093B1Jul 9, 2002

Process for planarization of metal-filled trenches of integrated circuit structures by forming a layer of planarizable material over the metal layer prior to planarizing

LSI LOGIC CORP52 citations91

US6066266AMay 23, 2000

In-situ chemical-mechanical polishing slurry formulation for compensation of polish pad degradation

LSI LOGIC CORP32 citations90

US6114215ASep 5, 2000

Generating non-planar topology on the surface of planar and near-planar substrates

LSI LOGIC CORP19 citations89

US6607967B1Aug 19, 2003

Process for forming planarized isolation trench in integrated circuit structure on semiconductor substrate

LSI LOGIC CORP19 citations84

US6106371AAug 22, 2000

Effective pad conditioning

LSI LOGIC CORP18 citations84

US5944585AAug 31, 1999

Use of abrasive tape conveying assemblies for conditioning polishing pads

LSI LOGIC CORP18 citations84

US6752916B1Jun 22, 2004

Electrochemical planarization end point detection

LSI LOGIC CORP10 citations73

US6489242B1Dec 3, 2002

Process for planarization of integrated circuit structure which inhibits cracking of low dielectric constant dielectric material adjacent underlying raised structures

LSI LOGIC CORP7 citations70

US6586326B2Jul 1, 2003

Metal planarization system

LSI LOGIC CORP3 citations62

US6372524B1Apr 16, 2002

Method for CMP endpoint detection

LSI LOGIC CORP4 citations62

US6951808B2Oct 4, 2005

Metal planarization system

LSI LOGIC CORP1 citations51

US6713394B2Mar 30, 2004

Process for planarization of integrated circuit structure which inhibits cracking of low dielectric constant dielectric material adjacent underlying raised structures

LSI LOGIC CORP1 citations48