Inventor
USUI YASUHIRO
JP5 patents
Patents
5 patentsUS6057168AMay 2, 2000
Method for forming bumps using dummy wafer
FUJITSU LTD14 citations71
US7291901B2Nov 6, 2007
Packaging method, packaging structure and package substrate for electronic parts
FUJITSU LTD3 citations61
US7268002B2Sep 11, 2007
Packaging method, packaging structure and package substrate for electronic parts
FUJITSU LTD3 citations61
US6869822B2Mar 22, 2005
Method of making a semiconductor device with adhesive sealing subjected to two-fold hardening
FUJITSU LTD3 citations60
US10408756B2Sep 10, 2019
Analysis method and analysis apparatus
FUJITSU LTD0 citations47