Inventor
LEE ED C
US14 patents
⚠️ This page may combine multiple inventors who share the name “LEE ED C”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ASML HOLDING NV
6 patentsUS6844027B1Jan 18, 2005
Environment exchange control for material on a wafer surface
ASML HOLDING NV13 citations91
US6669779B2Dec 30, 2003
Yield and line width performance for liquid polymers and other materials
ASML HOLDING NV14 citations90
US6780461B2Aug 24, 2004
Environment exchange control for material on a wafer surface
ASML HOLDING NV16 citations83
US6955720B2Oct 18, 2005
Plasma deposition of spin chucks to reduce contamination of Silicon wafers
ASML HOLDING NV2 citations61
US7255975B2Aug 14, 2007
Yield and line width performance for liquid polymers and other materials
ASML HOLDING NV3 citations60
US7625692B2Dec 1, 2009
Yield and line width performance for liquid polymers and other materials
ASML HOLDING NV0 citations50
SILICON VALLEY GROUP
4 patentsUS6468586B1Oct 22, 2002
Environment exchange control for material on a wafer surface
SILICON VALLEY GROUP15 citations91
US6254936B1Jul 3, 2001
Environment exchange control for material on a wafer surface
SILICON VALLEY GROUP33 citations91
US6248171B1Jun 19, 2001
Yield and line width performance for liquid polymers and other materials
SILICON VALLEY GROUP20 citations90
US6242364B1Jun 5, 2001
Plasma deposition of spin chucks to reduce contamination of silicon wafers
SILICON VALLEY GROUP11 citations72