Inventor

JIN LIWEN

US3 patents

⚠️ This page may combine multiple inventors who share the name “JIN LIWEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

INTEL CORP

2 patents

US9554468B2Jan 24, 2017

Panel with releasable core

INTEL CORP2 citations70

US9320149B2Apr 19, 2016

Bumpless build-up layer package including a release layer

INTEL CORP4 citations69

SENEVIRATNE DILAN

1 patent

US9451696B2Sep 20, 2016

Embedded architecture using resin coated copper

SENEVIRATNE DILAN1 citations40