Inventor

SEMKOW KRYSTYNA W

US41 patents

⚠️ This page may combine multiple inventors who share the name “SEMKOW KRYSTYNA W”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SEMKOW KRYSTYNA W

IBM

Electroless plating of metallic features on nonmetallic or semiconductor layer without extraneous plating

Corrosion protection for metallic features

Electrolytic method for the etch back of encapsulated copper-Invar-copper core structures

Multilayer pillar for reduced stress interconnect and method of making same

Multilayer pillar for reduced stress interconnect and method of making same

Multilayer pillar for reduced stress interconnect and method of making same

Under ball metallurgy (UBM) for improved electromigration

Electrolytic method for forming vias and through holes in copper-invar-copper core structures

Process of reworking pin grid array chip carriers

Selective etching of nickle/iron alloys

Selective electroetch of copper and other metals

High tin solder etching solution

Multilayer pillar for reduced stress interconnect and method of making same

Multilayer pillar for reduced stress interconnect and method of making same

Rework method for finishing metallurgy on chip carriers

Interconnect structure for surface mounted devices

Electronic package repair process

Method of selective plating on a substrate

Selective etch of TiW for capture pad formation

Multilayer pillar for reduced stress interconnect and method of making same

Additives for grain fragmentation in Pb-free Sn-based solder

Structures and methods to reduce maximum current density in a solder ball

Method for forming electrical connection to the inner layers of a multilayer circuit board

Electronic package repair process

ARVIN CHARLES L

Multi-anode system for uniform plating of alloys

Structures for improving current carrying capability of interconnects and methods of fabricating the same

Bump pad metallurgy employing an electrolytic Cu / electorlytic Ni / electrolytic Cu stack

Additives for grain fragmentation in Pb-free Sn-based solder

Structures for improving current carrying capability of interconnects and methods of fabricating the same

Multi-anode system for uniform plating of alloys

Multi-anode system for uniform plating of alloys

Underbump metallurgy employing an electrolytic Cu / electorlytic Ni / electrolytic Cu stack

Creation of lead-free solder joint with intermetallics

JADHAV VIRENDRA R

Multilayer pillar for reduced stress interconnect and method of making same

Multilayer pillar for reduced stress interconnect and method of making same

Multilayer pillar for reduced stress interconnect and method of making same

ELTRON RESEARCH INC

Apparatus for simultaneous generation of alkali metal species and oxygen gas

GLOBALFOUNDRIES INC

Electromigration-resistant lead-free solder interconnect structures

DAUBENSPECK TIMOTHY H

Offset solder vias, methods of manufacturing and design structures

BEZAMA RASCHID J

Structures and methods to reduce maximum current density in a solder ball

INTERNATINOAL BUSINESS MACHINES CORP

Semiconductor device having a copper plug