Inventor
HEINE DAVID J
US7 patents
⚠️ This page may combine multiple inventors who share the name “HEINE DAVID J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LSI LOGIC CORP
4 patentsUS5804249ASep 8, 1998
Multistep tungsten CVD process with amorphization step
LSI LOGIC CORP117 citations93
US6066561AMay 23, 2000
Apparatus and method for electrical determination of delamination at one or more interfaces within a semiconductor wafer
LSI LOGIC CORP39 citations91
US5769692AJun 23, 1998
On the use of non-spherical carriers for substrate chemi-mechanical polishing
LSI LOGIC CORP23 citations88
US6016009AJan 18, 2000
Integrated circuit with tungsten plug containing amorphization layer
LSI LOGIC CORP11 citations69