Inventor
CHIEN CHUN-HSIEN
TW28 patents
⚠️ This page may combine multiple inventors who share the name “CHIEN CHUN-HSIEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
UNIMICRON TECHNOLOGY CORP
27 patentsUS10888001B2Jan 5, 2021
Circuit carrier board structure and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP14 citations85
US11579178B1Feb 14, 2023
Inspection apparatus for bare circuit board
UNIMICRON TECHNOLOGY CORP8 citations82
US10461146B1Oct 29, 2019
Package structure and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP10 citations82
US12309943B2May 20, 2025
Circuit carrier and manufacturing method thereof and package structure
UNIMICRON TECHNOLOGY CORP2 citations74
US11251350B2Feb 15, 2022
Light-emitting diode package and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP2 citations72
US11139234B1Oct 5, 2021
Package carrier and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP2 citations72
US10660202B1May 19, 2020
Carrier structure and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP4 citations71
US10123418B1Nov 6, 2018
Circuit board structure and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP5 citations71
US9860980B1Jan 2, 2018
Circuit board element
UNIMICRON TECHNOLOGY CORP4 citations71
US9854671B1Dec 26, 2017
Circuit board and method of manufacturing the same
UNIMICRON TECHNOLOGY CORP4 citations71
US11678441B2Jun 13, 2023
Manufacturing method of circuit carrier board structure
UNIMICRON TECHNOLOGY CORP0 citations62
US11532543B2Dec 20, 2022
Manufacturing method of package carrier
UNIMICRON TECHNOLOGY CORP0 citations62
US11348869B2May 31, 2022
Method of manufacturing chip packaging structure
UNIMICRON TECHNOLOGY CORP0 citations61
US10950687B2Mar 16, 2021
Manufacturing method of substrate structure
UNIMICRON TECHNOLOGY CORP0 citations61
US10886264B2Jan 5, 2021
Manufacturing method of light-emitting diode package structure
UNIMICRON TECHNOLOGY CORP0 citations61
US10797017B2Oct 6, 2020
Embedded chip package, manufacturing method thereof, and package-on-package structure
UNIMICRON TECHNOLOGY CORP1 citations61
US10700049B2Jun 30, 2020
Light-emitting diode package structure and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP1 citations61
US12219711B2Feb 4, 2025
Bare circuit board
UNIMICRON TECHNOLOGY CORP0 citations56
US10700161B2Jun 30, 2020
Substrate structure and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP0 citations51
US11037869B2Jun 15, 2021
Package structure and preparation method thereof
UNIMICRON TECHNOLOGY CORP0 citations50
US11032917B2Jun 8, 2021
Circuit carrier board and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP0 citations50
US10937723B2Mar 2, 2021
Package carrier structure having integrated circuit design and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP0 citations50
US10879167B2Dec 29, 2020
Chip packaging structure and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP0 citations50
US12292468B2May 6, 2025
Inspection system and inspection method of bare circuit board
UNIMICRON TECHNOLOGY CORP0 citations49
US11201123B2Dec 14, 2021
Substrate structure and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP0 citations49
US10999939B2May 4, 2021
Circuit carrier board and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP0 citations49
US10863618B2Dec 8, 2020
Composite substrate structure and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP0 citations40