Inventor
TZU CHUNG-HSING
TW14 patents
⚠️ This page may combine multiple inventors who share the name “TZU CHUNG-HSING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMPO SEMICONDUCTOR CORP
4 patentsUS6201302B1Mar 13, 2001
Semiconductor package having multi-dies
SAMPO SEMICONDUCTOR CORP155 citations97
US5973407AOct 26, 1999
Integral heat spreader for semiconductor package
SAMPO SEMICONDUCTOR CORP28 citations90
US6101101AAug 8, 2000
Universal leadframe for semiconductor devices
SAMPO SEMICONDUCTOR CORP7 citations71
US5998857ADec 7, 1999
Semiconductor packaging structure with the bar on chip
SAMPO SEMICONDUCTOR CORP3 citations61
DOMINTECH CO LTD
3 patentsUS7187064B2Mar 6, 2007
Electrical-interference-isolated transistor structure
DOMINTECH CO LTD77 citations95
US7119420B2Oct 10, 2006
Chip packaging structure adapted to reduce electromagnetic interference
DOMINTECH CO LTD4 citations60
US7274098B2Sep 25, 2007
Chip packaging structure without leadframe
DOMINTECH CO LTD1 citations50