Inventor
YEW TEONG GUAN
MY8 patents
Patents
8 patentsUS10014710B2Jul 3, 2018
Foldable fabric-based packaging solution
INTEL CORP5 citations72
US10084698B2Sep 25, 2018
Selectively enabling first and second communication paths using a repeater
INTEL CORP5 citations71
US7109569B2Sep 19, 2006
Dual referenced microstrip
INTEL CORP8 citations71
US11805602B2Oct 31, 2023
Chip assemblies
INTEL CORP0 citations60
US12412784B2Sep 9, 2025
Recessed vertical interconnects for device miniaturization
INTEL CORP0 citations56
US11527481B2Dec 13, 2022
Stacked semiconductor package with flyover bridge
INTEL CORP0 citations50
US6686819B2Feb 3, 2004
Dual referenced microstrip
INTEL CORP0 citations50
US11562959B2Jan 24, 2023
Embedded dual-sided interconnect bridges for integrated-circuit packages
INTEL CORP0 citations49