Inventor

KIM UNG-KWANG

KR2 patents

Patents

2 patents

US7151009B2Dec 19, 2006

Method for manufacturing wafer level chip stack package

SAMSUNG ELECTRONICS CO LTD356 citations97

US7524763B2Apr 28, 2009

Fabrication method of wafer level chip scale packages

SAMSUNG ELECTRONICS CO LTD4 citations61