Inventor
CHENG SWEE KIAN
MY4 patents
⚠️ This page may combine multiple inventors who share the name “CHENG SWEE KIAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
3 patentsUS7173342B2Feb 6, 2007
Method and apparatus for reducing electrical interconnection fatigue
INTEL CORP8 citations71
US7789285B2Sep 7, 2010
Solder printing process to reduce void formation in a microvia
INTEL CORP2 citations56
US7331503B2Feb 19, 2008
Solder printing process to reduce void formation in a microvia
INTEL CORP0 citations45