Inventor
LIU YI-LIANG
TW9 patents
Patents
9 patentsUS9773682B1Sep 26, 2017
Method of planarizing substrate surface
UNITED MICROELECTRONICS CORP5 citations83
US9147612B2Sep 29, 2015
Method for forming a semiconductor structure
UNITED MICROELECTRONICS CORP7 citations83
US9905430B1Feb 27, 2018
Method for forming semiconductor structure
UNITED MICROELECTRONICS CORP4 citations72
US9875909B1Jan 23, 2018
Method for planarizing material layer
UNITED MICROELECTRONICS CORP3 citations72
US10103034B2Oct 16, 2018
Method of planarizing substrate surface
UNITED MICROELECTRONICS CORP0 citations51
US10049887B2Aug 14, 2018
Method of planarizing substrate surface
UNITED MICROELECTRONICS CORP0 citations51
US9299600B2Mar 29, 2016
Method for repairing an oxide layer and method for manufacturing a semiconductor structure applying the same
UNITED MICROELECTRONICS CORP0 citations51
US9093465B2Jul 28, 2015
Method of fabricating semiconductor device
UNITED MICROELECTRONICS CORP1 citations51
US9972498B2May 15, 2018
Method of fabricating a gate cap layer
UNITED MICROELECTRONICS CORP0 citations41