Inventor
KOCIAN THOMAS ALLAN
US10 patents
Patents
10 patentsUS9093444B2Jul 28, 2015
Wafer level package solder barrier used as vacuum getter
RAYTHEON CO4 citations83
US8736045B1May 27, 2014
Integrated bondline spacers for wafer level packaged circuit devices
RAYTHEON CO8 citations82
US9334154B2May 10, 2016
Hermetically sealed package having stress reducing layer
RAYTHEON CO2 citations60
US9969610B2May 15, 2018
Wafer level MEMS package including dual seal ring
RAYTHEON CO1 citations50
US9771258B2Sep 26, 2017
Wafer level MEMS package including dual seal ring
RAYTHEON CO0 citations50
US9196556B2Nov 24, 2015
Getter structure and method for forming such structure
RAYTHEON CO0 citations50
US9187312B2Nov 17, 2015
Integrated bondline spacers for wafer level packaged circuit devices
RAYTHEON CO0 citations50
US9174836B2Nov 3, 2015
Integrated bondline spacers for wafer level packaged circuit devices
RAYTHEON CO0 citations50
US9708181B2Jul 18, 2017
Hermetically sealed package having stress reducing layer
RAYTHEON CO0 citations49
US9105800B2Aug 11, 2015
Method of forming deposited patterns on a surface
RAYTHEON CO0 citations39