Inventor
BONSER DOUGLAS J
TW22 patents
⚠️ This page may combine multiple inventors who share the name “BONSER DOUGLAS J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ADVANCED MICRO DEVICES INC
21 patentsUS6773998B1Aug 10, 2004
Modified film stack and patterning strategy for stress compensation and prevention of pattern distortion in amorphous carbon gate patterning
ADVANCED MICRO DEVICES INC208 citations99
US6893967B1May 17, 2005
L-shaped spacer incorporating or patterned using amorphous carbon or CVD organic materials
ADVANCED MICRO DEVICES INC246 citations98
US6750127B1Jun 15, 2004
Method for fabricating a semiconductor device using amorphous carbon having improved etch resistance
ADVANCED MICRO DEVICES INC61 citations96
US6673635B1Jan 6, 2004
Method for alignment mark formation for a shallow trench isolation process
ADVANCED MICRO DEVICES INC55 citations96
US6797552B1Sep 28, 2004
Method for defect reduction and enhanced control over critical dimensions and profiles in semiconductor devices
ADVANCED MICRO DEVICES INC22 citations93
US6979651B1Dec 27, 2005
Method for forming alignment features and back-side contacts with fewer lithography and etch steps
ADVANCED MICRO DEVICES INC19 citations92
US6764949B2Jul 20, 2004
Method for reducing pattern deformation and photoresist poisoning in semiconductor device fabrication
ADVANCED MICRO DEVICES INC53 citations92
US6881616B1Apr 19, 2005
System for forming a semiconductor device and method thereof including implanting through a L shaped spacer to form source and drain regions
ADVANCED MICRO DEVICES INC24 citations91
US6165906ADec 26, 2000
Semiconductor topography employing a shallow trench isolation structure with an improved trench edge
ADVANCED MICRO DEVICES INC22 citations91
US6900139B1May 31, 2005
Method for photoresist trim endpoint detection
ADVANCED MICRO DEVICES INC25 citations89
US7091106B2Aug 15, 2006
Method of reducing STI divot formation during semiconductor device fabrication
ADVANCED MICRO DEVICES INC18 citations83
US6365481B1Apr 2, 2002
Isotropic resistor protect etch to aid in residue removal
ADVANCED MICRO DEVICES INC18 citations83
US6913958B1Jul 5, 2005
Method for patterning a feature using a trimmed hardmask
ADVANCED MICRO DEVICES INC9 citations74
US6849530B2Feb 1, 2005
Method for semiconductor gate line dimension reduction
ADVANCED MICRO DEVICES INC10 citations74
US6764947B1Jul 20, 2004
Method for reducing gate line deformation and reducing gate line widths in semiconductor devices
ADVANCED MICRO DEVICES INC9 citations74
US6309947B1Oct 30, 2001
Method of manufacturing a semiconductor device with improved isolation region to active region topography
ADVANCED MICRO DEVICES INC7 citations74
US6734088B1May 11, 2004
Control of two-step gate etch process
ADVANCED MICRO DEVICES INC8 citations71
US7268066B2Sep 11, 2007
Method for semiconductor gate line dimension reduction
ADVANCED MICRO DEVICES INC4 citations63
US6812077B1Nov 2, 2004
Method for patterning narrow gate lines
ADVANCED MICRO DEVICES INC6 citations62
US6555397B1Apr 29, 2003
Dry isotropic removal of inorganic anti-reflective coating after poly gate etching
ADVANCED MICRO DEVICES INC4 citations61
US7223698B1May 29, 2007
Method of forming a semiconductor arrangement with reduced field-to active step height
ADVANCED MICRO DEVICES INC2 citations57