Inventor
CHEN CHIEH-TE
TW62 patents
⚠️ This page may combine multiple inventors who share the name “CHEN CHIEH-TE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
UNITED MICROELECTRONICS CORP
43 patentsUS10043809B1Aug 7, 2018
Semiconductor device and method for fabricating the same
UNITED MICROELECTRONICS CORP17 citations94
US8962490B1Feb 24, 2015
Method for fabricating semiconductor device
UNITED MICROELECTRONICS CORP19 citations93
US10186513B2Jan 22, 2019
Semiconductor device and method of forming the same
UNITED MICROELECTRONICS CORP9 citations84
US10049929B2Aug 14, 2018
Method of making semiconductor structure having contact plug
UNITED MICROELECTRONICS CORP11 citations84
US9673100B2Jun 6, 2017
Semiconductor device having contact plug in two dielectric layers and two etch stop layers
UNITED MICROELECTRONICS CORP7 citations84
US9349812B2May 24, 2016
Semiconductor device with self-aligned contact and method of manufacturing the same
UNITED MICROELECTRONICS CORP18 citations84
US8993433B2Mar 31, 2015
Manufacturing method for forming a self aligned contact
UNITED MICROELECTRONICS CORP9 citations84
US8785283B2Jul 22, 2014
Method for forming semiconductor structure having metal connection
UNITED MICROELECTRONICS CORP8 citations84
US10373957B2Aug 6, 2019
Capacitor structure and fabrication method thereof
UNITED MICROELECTRONICS CORP6 citations83
US8916475B1Dec 23, 2014
Patterning method
UNITED MICROELECTRONICS CORP12 citations81
US10818664B2Oct 27, 2020
Method of forming semiconductor memory device
UNITED MICROELECTRONICS CORP2 citations73
US10593677B2Mar 17, 2020
Semiconductor structure with capacitor landing pad and method of make the same
UNITED MICROELECTRONICS CORP2 citations73
US10347644B2Jul 9, 2019
Manufacturing method of semiconductor device
UNITED MICROELECTRONICS CORP3 citations73
US10312090B2Jun 4, 2019
Patterning method
UNITED MICROELECTRONICS CORP3 citations73
US9728455B2Aug 8, 2017
Semiconductor device and method for fabricating the same
UNITED MICROELECTRONICS CORP3 citations73
US10249629B1Apr 2, 2019
Method for forming buried word lines
UNITED MICROELECTRONICS CORP4 citations72
US9023708B2May 5, 2015
Method of forming semiconductor device
UNITED MICROELECTRONICS CORP6 citations72
US6316368B1Nov 13, 2001
Method of fabricating a node contact
UNITED MICROELECTRONICS CORP12 citations71
US11107879B2Aug 31, 2021
Capacitor structure and fabrication method thereof
UNITED MICROELECTRONICS CORP3 citations70
US10825818B2Nov 3, 2020
Method of forming semiconductor device
UNITED MICROELECTRONICS CORP1 citations63
US10559651B2Feb 11, 2020
Method of forming memory capacitor
UNITED MICROELECTRONICS CORP1 citations63
US10361080B2Jul 23, 2019
Patterning method
UNITED MICROELECTRONICS CORP1 citations63
US9196352B2Nov 24, 2015
Static random access memory unit cell structure and static random access memory unit cell layout structure
UNITED MICROELECTRONICS CORP2 citations63
US11289489B2Mar 29, 2022
Capacitor structure
UNITED MICROELECTRONICS CORP0 citations62
US10490555B2Nov 26, 2019
Method of forming semiconductor memory device
UNITED MICROELECTRONICS CORP1 citations62
US10418367B2Sep 17, 2019
Method for fabricating air gap adjacent to two sides of bit line
UNITED MICROELECTRONICS CORP1 citations62
US10366889B2Jul 30, 2019
Method of forming semiconductor device
UNITED MICROELECTRONICS CORP1 citations62
US10658366B2May 19, 2020
Semiconductor device and method for fabricating the same
UNITED MICROELECTRONICS CORP1 citations61
US8026571B2Sep 27, 2011
Semiconductor-device isolation structure
UNITED MICROELECTRONICS CORP6 citations58
US10784265B2Sep 22, 2020
Semiconductor device
UNITED MICROELECTRONICS CORP0 citations52
US10734284B2Aug 4, 2020
Method of self-aligned double patterning
UNITED MICROELECTRONICS CORP0 citations52
US10658173B2May 19, 2020
Method for fabricating a semiconductor structure on a semiconductor wafer
UNITED MICROELECTRONICS CORP0 citations52
US10446554B2Oct 15, 2019
Semiconductor memory device and method of forming the same
UNITED MICROELECTRONICS CORP0 citations52
US9748349B2Aug 29, 2017
Semiconductor device
UNITED MICROELECTRONICS CORP1 citations52
US9583388B2Feb 28, 2017
Semiconductor device and method for fabricating the same
UNITED MICROELECTRONICS CORP0 citations52
US9455135B2Sep 27, 2016
Method for fabricating semiconductor device
UNITED MICROELECTRONICS CORP0 citations52
US9281367B2Mar 8, 2016
Semiconductor structure having contact plug and method of making the same
UNITED MICROELECTRONICS CORP0 citations52
US10622362B2Apr 14, 2020
Capacitor structure and fabrication method thereof
UNITED MICROELECTRONICS CORP0 citations51
US9620369B2Apr 11, 2017
Method for fabricating semiconductor device to integrate transistor with passive device
UNITED MICROELECTRONICS CORP0 citations51
US9337084B1May 10, 2016
Method for manufacturing contact holes of a semiconductor device
UNITED MICROELECTRONICS CORP1 citations51
US9312258B2Apr 12, 2016
Strained silicon structure
UNITED MICROELECTRONICS CORP1 citations51
US9165997B2Oct 20, 2015
Semiconductor process
UNITED MICROELECTRONICS CORP1 citations51
US9263294B2Feb 16, 2016
Method of forming semiconductor device
UNITED MICROELECTRONICS CORP0 citations50
CHEN CHIEH-TE
3 patentsHWANG GUANG-YAW
1 patentUNITED MICROELECTRNICS CORP
1 patentDER EE ELECTRICAL INSTR CO LTD
1 patentWANG I-CHANG
1 patentShowing the top 50 of 62 patents by PatentIndex Score.