P

Inventor

CHANG FENG-YI

TW141 patents
⚠️ This page may combine multiple inventors who share the name “CHANG FENG-YI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

UNITED MICROELECTRONICS CORP

49 patents
US9209273B1Dec 8, 2015

Method of fabricating metal gate structure

UNITED MICROELECTRONICS CORP59 citations97
US10043809B1Aug 7, 2018

Semiconductor device and method for fabricating the same

UNITED MICROELECTRONICS CORP17 citations94
US10366993B2Jul 30, 2019

Semiconductor structure having air gap between gate electrode and distal end portion of active area

UNITED MICROELECTRONICS CORP6 citations84
US10354876B1Jul 16, 2019

Semiconductor device and method of forming the same

UNITED MICROELECTRONICS CORP10 citations84
US10312088B1Jun 4, 2019

Self-aligned double patterning method

UNITED MICROELECTRONICS CORP7 citations84
US10186513B2Jan 22, 2019

Semiconductor device and method of forming the same

UNITED MICROELECTRONICS CORP9 citations84
US10170362B2Jan 1, 2019

Semiconductor memory device with bit line contact structure and method of forming the same

UNITED MICROELECTRONICS CORP5 citations84
US10147728B1Dec 4, 2018

Semiconductor device and method for fabricating the same

UNITED MICROELECTRONICS CORP8 citations84
US10062613B1Aug 28, 2018

Semiconductor device and method for fabricating the same

UNITED MICROELECTRONICS CORP6 citations84
US9780193B2Oct 3, 2017

Device with reinforced metal gate spacer and method of fabricating

UNITED MICROELECTRONICS CORP6 citations84
US9698255B2Jul 4, 2017

Semiconductor device having gate structure with doped hard mask

UNITED MICROELECTRONICS CORP5 citations84
US9673100B2Jun 6, 2017

Semiconductor device having contact plug in two dielectric layers and two etch stop layers

UNITED MICROELECTRONICS CORP7 citations84
US9543211B1Jan 10, 2017

Semiconductor structure and manufacturing method thereof

UNITED MICROELECTRONICS CORP15 citations84
US9530851B1Dec 27, 2016

Semiconductor device and manufacturing methods thereof

UNITED MICROELECTRONICS CORP15 citations84
US9490334B2Nov 8, 2016

Semiconductor device having metal gate and manufacturing method thereof

UNITED MICROELECTRONICS CORP8 citations84
US9349812B2May 24, 2016

Semiconductor device with self-aligned contact and method of manufacturing the same

UNITED MICROELECTRONICS CORP18 citations84
US9263540B1Feb 16, 2016

Metal gate structure

UNITED MICROELECTRONICS CORP8 citations84
US9214392B1Dec 15, 2015

Method of forming contact hole and semiconductor structure with contact plug

UNITED MICROELECTRONICS CORP7 citations84
US8993433B2Mar 31, 2015

Manufacturing method for forming a self aligned contact

UNITED MICROELECTRONICS CORP9 citations84
US8785283B2Jul 22, 2014

Method for forming semiconductor structure having metal connection

UNITED MICROELECTRONICS CORP8 citations84
US10373957B2Aug 6, 2019

Capacitor structure and fabrication method thereof

UNITED MICROELECTRONICS CORP6 citations83
US10217750B1Feb 26, 2019

Buried word line structure and method of making the same

UNITED MICROELECTRONICS CORP9 citations83
US9230864B1Jan 5, 2016

Method of forming a semiconductor device having a metal gate

UNITED MICROELECTRONICS CORP18 citations83
US8916475B1Dec 23, 2014

Patterning method

UNITED MICROELECTRONICS CORP12 citations81
US10854613B2Dec 1, 2020

Buried word line of a dynamic random access memory and method for fabricating the same

UNITED MICROELECTRONICS CORP2 citations73
US10818664B2Oct 27, 2020

Method of forming semiconductor memory device

UNITED MICROELECTRONICS CORP2 citations73
US10784334B2Sep 22, 2020

Method of manufacturing a capacitor

UNITED MICROELECTRONICS CORP4 citations73
US10593677B2Mar 17, 2020

Semiconductor structure with capacitor landing pad and method of make the same

UNITED MICROELECTRONICS CORP2 citations73
US10431679B2Oct 1, 2019

Semiconductor device and method for forming the same

UNITED MICROELECTRONICS CORP3 citations73
US10381239B2Aug 13, 2019

Method of forming semiconductor device

UNITED MICROELECTRONICS CORP2 citations73
US10347644B2Jul 9, 2019

Manufacturing method of semiconductor device

UNITED MICROELECTRONICS CORP3 citations73
US10332887B2Jun 25, 2019

Buried word line of a dynamic random access memory and method for fabricating the same

UNITED MICROELECTRONICS CORP1 citations73
US10332978B2Jun 25, 2019

Device with reinforced metal gate spacer and method of fabricating

UNITED MICROELECTRONICS CORP2 citations73
US10312090B2Jun 4, 2019

Patterning method

UNITED MICROELECTRONICS CORP3 citations73
US10153165B1Dec 11, 2018

Patterning method

UNITED MICROELECTRONICS CORP3 citations73
US10147726B1Dec 4, 2018

Semiconductor device and method for fabricating the same

UNITED MICROELECTRONICS CORP4 citations73
US10103250B2Oct 16, 2018

Method of fabricating semiconductor device

UNITED MICROELECTRONICS CORP3 citations73
US9985123B2May 29, 2018

Method for fabricating a semiconductor device having gate structure with doped hard mask

UNITED MICROELECTRONICS CORP2 citations73
US9728455B2Aug 8, 2017

Semiconductor device and method for fabricating the same

UNITED MICROELECTRONICS CORP3 citations73
US9711411B2Jul 18, 2017

Semiconductor device and method for fabricating the same

UNITED MICROELECTRONICS CORP3 citations73
US9685531B2Jun 20, 2017

Method for manufacturing semiconductor device having metal gate

UNITED MICROELECTRONICS CORP3 citations73
US9640484B2May 2, 2017

Semiconductor device and manufacturing method thereof

UNITED MICROELECTRONICS CORP4 citations73
US9548239B2Jan 17, 2017

Method for fabricating contact plug in an interlayer dielectric layer

UNITED MICROELECTRONICS CORP3 citations73
US10795255B2Oct 6, 2020

Method of forming layout definition of semiconductor device

UNITED MICROELECTRONICS CORP2 citations72
US10497704B2Dec 3, 2019

Buried word line structure and method of making the same

UNITED MICROELECTRONICS CORP3 citations72
US10381306B2Aug 13, 2019

Semiconductor memory device and a manufacturing method thereof

UNITED MICROELECTRONICS CORP1 citations72
US9324620B2Apr 26, 2016

Metal gate structure and method of making the same

UNITED MICROELECTRONICS CORP6 citations72
US9023708B2May 5, 2015

Method of forming semiconductor device

UNITED MICROELECTRONICS CORP6 citations72
US10777559B1Sep 15, 2020

Semiconductor memory device and manufacturing method thereof

UNITED MICROELECTRONICS CORP3 citations71

CHANG FENG-YI

1 patent

Showing the top 50 of 141 patents by PatentIndex Score.