Inventor
MAO WEI-JHIH
TW10 patents
Patents
10 patentsUS12497285B2Dec 16, 2025
Stopper bump structures for MEMS device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11661333B2May 30, 2023
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12412863B2Sep 9, 2025
Die attached leveling control by metal stopper bumps
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12322722B2Jun 3, 2025
Die attached leveling control by metal stopper bumps
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11993510B2May 28, 2024
Composite spring structure to reinforce mechanical robustness of a MEMS device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11923331B2Mar 5, 2024
Die attached leveling control by metal stopper bumps
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11420866B2Aug 23, 2022
Composite spring structure to reinforce mechanical robustness of a MEMS device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11235969B2Feb 1, 2022
CMOS-MEMS integration with through-chip via process
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12358783B2Jul 15, 2025
Wire-bond damper for shock absorption
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US11987494B2May 21, 2024
Wire-bond damper for shock absorption
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60