P

Inventor

ZHANG JINGCHUN

US36 patents
⚠️ This page may combine multiple inventors who share the name “ZHANG JINGCHUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

APPLIED MATERIALS INC

27 patents
US9842744B2Dec 12, 2017

Methods for etch of SiN films

APPLIED MATERIALS INC113 citations99
US9449845B2Sep 20, 2016

Selective titanium nitride etching

APPLIED MATERIALS INC138 citations99
US9437451B2Sep 6, 2016

Radical-component oxide etch

APPLIED MATERIALS INC134 citations99
US9418858B2Aug 16, 2016

Selective etch of silicon by way of metastable hydrogen termination

APPLIED MATERIALS INC138 citations99
US9343327B2May 17, 2016

Methods for etch of sin films

APPLIED MATERIALS INC147 citations99
US9236266B2Jan 12, 2016

Dry-etch for silicon-and-carbon-containing films

APPLIED MATERIALS INC153 citations99
US9093390B2Jul 28, 2015

Conformal oxide dry etch

APPLIED MATERIALS INC185 citations99
US9023734B2May 5, 2015

Radical-component oxide etch

APPLIED MATERIALS INC182 citations99
US8921234B2Dec 30, 2014

Selective titanium nitride etching

APPLIED MATERIALS INC187 citations99
US8801952B1Aug 12, 2014

Conformal oxide dry etch

APPLIED MATERIALS INC191 citations99
US8765574B2Jul 1, 2014

Dry etch process

APPLIED MATERIALS INC182 citations99
US8642481B2Feb 4, 2014

Dry-etch for silicon-and-nitrogen-containing films

APPLIED MATERIALS INC188 citations99
US10062578B2Aug 28, 2018

Methods for etch of metal and metal-oxide films

APPLIED MATERIALS INC94 citations98
US9754800B2Sep 5, 2017

Selective etch for silicon films

APPLIED MATERIALS INC110 citations98
US9576809B2Feb 21, 2017

Etch suppression with germanium

APPLIED MATERIALS INC131 citations98
US9472412B2Oct 18, 2016

Procedure for etch rate consistency

APPLIED MATERIALS INC132 citations98
US9390937B2Jul 12, 2016

Silicon-carbon-nitride selective etch

APPLIED MATERIALS INC132 citations98
US9245762B2Jan 26, 2016

Procedure for etch rate consistency

APPLIED MATERIALS INC165 citations98
US9034770B2May 19, 2015

Differential silicon oxide etch

APPLIED MATERIALS INC181 citations98
US9887096B2Feb 6, 2018

Differential silicon oxide etch

APPLIED MATERIALS INC113 citations97
US9881805B2Jan 30, 2018

Silicon selective removal

APPLIED MATERIALS INC110 citations97
US9564338B1Feb 7, 2017

Silicon-selective removal

APPLIED MATERIALS INC124 citations97
US11637002B2Apr 25, 2023

Methods and systems to enhance process uniformity

APPLIED MATERIALS INC4 citations74
US10892198B2Jan 12, 2021

Systems and methods for improved performance in semiconductor processing

APPLIED MATERIALS INC4 citations66
US8541312B2Sep 24, 2013

Selective suppression of dry-etch rate of materials containing both silicon and nitrogen

APPLIED MATERIALS INC3 citations63
US11239061B2Feb 1, 2022

Methods and systems to enhance process uniformity

APPLIED MATERIALS INC0 citations62
US10026597B2Jul 17, 2018

Hydrogen plasma based cleaning process for etch hardware

APPLIED MATERIALS INC1 citations49

ZHANG JINGCHUN

5 patents

WANG YUNYU

2 patents

WANG ANCHUAN

1 patent

Suzhou opple lighting co ltd

1 patent