Inventor

MARTIN YVES

US67 patents

⚠️ This page may combine multiple inventors who share the name “MARTIN YVES”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MARTIN YVES

IBM

Optimized solder pads for solder induced alignment of opto-electronic chips

High density magnetic thermal recording and reproducing assembly

Calibration standards for profilometers and methods of producing them

Two dimensional profiling with a contact force atomic force microscope

Atomic photo-absorption force microscope

Surface profiling using scanning force microscopy

Automatic tip approach method and apparatus for scanning probe microscope

Active liquid metal thermal spreader

Heterogeneous thermal interface for cooling

Assembly for writing and/or erasing high density data on a media

Assembly suitable for writing high density data on a ferroelectric media

Apparatus and method suitable for magnetic-thermal recording

Assembly suitable for reading/writing/erasing information on a media based on thermal coupling

Ultrafine silicon tips for AFM/STM profilometry

Method of producing ultrafine silicon tips for the afm/stm profilometry

Dual quad flexure scanner

Single edge coupling of chips with integrated waveguides

Structure and methods of processing for solder thermal interface materials for chip cooling

Method and package for circuit chip packaging

Active liquid metal thermal spreader

Device and method for generating an x-ray point source by geometric confinement

Assembly suitable for reading data based on thermal coupling

Method for writing and/or erasing high density data on a media

Interferometric near-field apparatus based on multi-pole sensing

Housing apparatus for sensitive gas sensor

Single edge coupling of chips with integrated waveguides

Single edge coupling of chips with integrated waveguides

Optimized solder pads for solder induced alignment of opto-electronic chips

Interferometric detecting/imaging method based on multi-pole sensing

Solder-pinning metal pads for electronic components

Method of assembling a fugitive gas sensor enclosure

Optimized stand-offs and mechanical stops for precise three dimensional self-alignment

Structure for cooling a surface

MARTIN YVES

Sealing and cooling at the joint between shroud segments

Shroud segment arrangement for gas turbine engines

Thermal ground plane for cooling a computer

Insonification device that includes a three-dimensional network of emitters arranged in at least two concentric spirals, which are designed to generate a beam of high-intensity focussed waves

HITACHI GLOBAL STORAGE TECH

Assembly and method suitable for thermo-magnetic writing/reading of data

Assembly comprising a plurality of media probes for writing/reading high density magnetic data

GUHA SUPRATIK

Grid-line-free contact for a photovoltaic cell

Grid-line-free contact for a photovoltaic cell

TECHNOMED MEDICAL SYSTEMS

Fluid manipulating system for therapy apparatus

CASCADES CANADA ULC

Method of making wet embossed paperboard

BELANGER MARTIN

Parts securing mechanism and method thereof

IRUVANTI SUSHUMNA

Method and package for circuit chip packaging

CHATELOIS BRUNO

Rotor containment structure for gas turbine engine

PRATT & WHITNEY CANADA

Movement-constraining assembly for fluid-conveying system

SES IMAGOTAG

Method and a system for displaying product information on electronic labels

COMMISSARIAT ENERGIE ATOMIQUE

Electrolyzer and a method for the production of readily oxydizable metals in a state of high purity

CIT ALCATEL

Method and apparatus for tinning tinnable areas on an electronic component package