Inventor
BROADBENT ELIOT K
US28 patents
⚠️ This page may combine multiple inventors who share the name “BROADBENT ELIOT K”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NOVELLUS SYSTEMS INC
21 patentsUS6027631AFeb 22, 2000
Electroplating system with shields for varying thickness profile of deposited layer
NOVELLUS SYSTEMS INC318 citations99
US5405480AApr 11, 1995
Induction plasma source
NOVELLUS SYSTEMS INC162 citations99
US5238499AAug 24, 1993
Gas-based substrate protection during processing
NOVELLUS SYSTEMS INC411 citations99
US6162344ADec 19, 2000
Method of electroplating semiconductor wafer using variable currents and mass transfer to obtain uniform plated layer
NOVELLUS SYSTEMS INC179 citations98
US6110346AAug 29, 2000
Method of electroplating semicoductor wafer using variable currents and mass transfer to obtain uniform plated layer
NOVELLUS SYSTEMS INC158 citations98
US6074544AJun 13, 2000
Method of electroplating semiconductor wafer using variable currents and mass transfer to obtain uniform plated layer
NOVELLUS SYSTEMS INC288 citations98
US5230741AJul 27, 1993
Gas-based backside protection during substrate processing
NOVELLUS SYSTEMS INC118 citations98
US5882417AMar 16, 1999
Apparatus for preventing deposition on frontside peripheral region and edge of wafer in chemical vapor deposition apparatus
NOVELLUS SYSTEMS INC90 citations97
US5843233ADec 1, 1998
Exclusion guard and gas-based substrate protection for chemical vapor deposition apparatus
NOVELLUS SYSTEMS INC51 citations96
US5620525AApr 15, 1997
Apparatus for supporting a substrate and introducing gas flow doximate to an edge of the substrate
NOVELLUS SYSTEMS INC114 citations96
US5578532ANov 26, 1996
Wafer surface protection in a gas deposition process
NOVELLUS SYSTEMS INC91 citations96
US5374594ADec 20, 1994
Gas-based backside protection during substrate processing
NOVELLUS SYSTEMS INC56 citations96
US5346578ASep 13, 1994
Induction plasma source
NOVELLUS SYSTEMS INC242 citations96
US5188717AFeb 23, 1993
Sweeping method and magnet track apparatus for magnetron sputtering
NOVELLUS SYSTEMS INC79 citations96
US5171415ADec 15, 1992
Cooling method and apparatus for magnetron sputtering
NOVELLUS SYSTEMS INC70 citations96
US6554914B1Apr 29, 2003
Passivation of copper in dual damascene metalization
NOVELLUS SYSTEMS INC62 citations95
US5925411AJul 20, 1999
Gas-based substrate deposition protection
NOVELLUS SYSTEMS INC72 citations95
US5769951AJun 23, 1998
Exclusion guard and gas-based substrate protection for chemical vapor deposition apparatus
NOVELLUS SYSTEMS INC51 citations95
US6709565B2Mar 23, 2004
Method and apparatus for uniform electropolishing of damascene ic structures by selective agitation
NOVELLUS SYSTEMS INC42 citations92
US6225744B1May 1, 2001
Plasma process apparatus for integrated circuit fabrication having dome-shaped induction coil
NOVELLUS SYSTEMS INC27 citations92
US5605599AFeb 25, 1997
Method of generating plasma having high ion density for substrate processing operation
NOVELLUS SYSTEMS INC18 citations92
SIGNETICS CORP
3 patentsUS4517225AMay 14, 1985
Method for manufacturing an electrical interconnection by selective tungsten deposition
SIGNETICS CORP42 citations92
US4495221AJan 22, 1985
Variable rate semiconductor deposition process
SIGNETICS CORP22 citations82
US4612257ASep 16, 1986
Electrical interconnection for semiconductor integrated circuits
SIGNETICS CORP6 citations63
NORTH AMERICAN PHILIPS CORP SI
2 patentsUS5063175ANov 5, 1991
Method for manufacturing a planar electrical interconnection utilizing isotropic deposition of conductive material
NORTH AMERICAN PHILIPS CORP SI69 citations96
US4976809ADec 11, 1990
Method of forming an aluminum conductor with highly oriented grain structure
NORTH AMERICAN PHILIPS CORP SI25 citations92