Inventor

PAO YI-HSIN

US5 patents

⚠️ This page may combine multiple inventors who share the name “PAO YI-HSIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

FORD MOTOR CO

2 patents

US5931371AAug 3, 1999

Standoff controlled interconnection

FORD MOTOR CO117 citations95

US5386343AJan 31, 1995

Double surface mount technology for electronic packaging

FORD MOTOR CO66 citations93

FORD GLOBAL TECH INC

2 patents

US5736786AApr 7, 1998

Power module with silicon dice oriented for improved reliability

FORD GLOBAL TECH INC16 citations68

US5813884ASep 29, 1998

Meniscus-shape terminations for leadless electronic components

FORD GLOBAL TECH INC0 citations45

FORD GLOBAL TECH

1 patent

US5936846AAug 10, 1999

Optimized solder joints and lifter pads for improving the solder joint life of surface mount chips

FORD GLOBAL TECH31 citations91