Inventor
KOON ENG MEOW
SG23 patents
⚠️ This page may combine multiple inventors who share the name “KOON ENG MEOW”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
18 patentsUS6855572B2Feb 15, 2005
Castellation wafer level packaging of integrated circuit chips
MICRON TECHNOLOGY INC96 citations98
US6894386B2May 17, 2005
Apparatus and method for packaging circuits
MICRON TECHNOLOGY INC69 citations97
US6552910B1Apr 22, 2003
Stacked-die assemblies with a plurality of microelectronic devices and methods of manufacture
MICRON TECHNOLOGY INC331 citations97
US7115986B2Oct 3, 2006
Flexible ball grid array chip scale packages
MICRON TECHNOLOGY INC114 citations96
US6949407B2Sep 27, 2005
Castellation wafer level packaging of integrated circuit chips
MICRON TECHNOLOGY INC42 citations96
US6836009B2Dec 28, 2004
Packaged microelectronic components
MICRON TECHNOLOGY INC51 citations96
US7358154B2Apr 15, 2008
Method for fabricating packaged die
MICRON TECHNOLOGY INC30 citations95
US7712211B2May 11, 2010
Method for packaging circuits and packaged circuits
MICRON TECHNOLOGY INC26 citations92
US7679179B2Mar 16, 2010
Castellation wafer level packaging of integrated circuit chips
MICRON TECHNOLOGY INC8 citations92
US7528477B2May 5, 2009
Castellation wafer level packaging of integrated circuit chips
MICRON TECHNOLOGY INC10 citations92
US7195957B2Mar 27, 2007
Packaged microelectronic components
MICRON TECHNOLOGY INC25 citations92
US8008126B2Aug 30, 2011
Castellation wafer level packaging of integrated circuit chips
MICRON TECHNOLOGY INC7 citations84
US7947529B2May 24, 2011
Microelectronic die packages with leadframes, including leadframe-based interposer for stacked die packages, and associated systems and methods
MICRON TECHNOLOGY INC13 citations84
US7675169B2Mar 9, 2010
Apparatus and method for packaging circuits
MICRON TECHNOLOGY INC9 citations82
US6836008B2Dec 28, 2004
Semiconductor packages with leadframe grid arrays and components
MICRON TECHNOLOGY INC10 citations73
US7276387B2Oct 2, 2007
Castellation wafer level packaging of integrated circuit chips
MICRON TECHNOLOGY INC2 citations62
US7170161B2Jan 30, 2007
In-process semiconductor packages with leadframe grid arrays
MICRON TECHNOLOGY INC2 citations62
US6967127B2Nov 22, 2005
Methods for making semiconductor packages with leadframe grid arrays
MICRON TECHNOLOGY INC1 citations62