Inventor

SHIU CHUAN-JIN

TW14 patents

⚠️ This page may combine multiple inventors who share the name “SHIU CHUAN-JIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SHIU CHUAN-JIN

3 patents

US8890191B2Nov 18, 2014

Chip package and method for forming the same

SHIU CHUAN-JIN13 citations81

US8785956B2Jul 22, 2014

Chip package having optical-electronic device with plurality of light shielding layers and substrate through-hole with void, and method for forming the same

SHIU CHUAN-JIN2 citations56

US8900913B2Dec 2, 2014

Chip package and method for forming the same

SHIU CHUAN-JIN0 citations39

CHIU HSIN-CHIH

3 patents

US8431946B2Apr 30, 2013

Chip package and method for forming the same

CHIU HSIN-CHIH2 citations60

US8604578B2Dec 10, 2013

Chip package

CHIU HSIN-CHIH1 citations49

US8384174B2Feb 26, 2013

Chip package

CHIU HSIN-CHIH1 citations49

XINTEC INC

3 patents

US9613904B2Apr 4, 2017

Semiconductor structure and manufacturing method thereof

XINTEC INC0 citations51

US10388541B2Aug 20, 2019

Wafer coating system and method of manufacturing chip package

XINTEC INC0 citations47

US9230927B2Jan 5, 2016

Method of fabricating wafer-level chip package

XINTEC INC1 citations47

LIU TSANG-YU

2 patents

US8575634B2Nov 5, 2013

Chip package and method for fabricating the same

LIU TSANG-YU9 citations82

US8536671B2Sep 17, 2013

Chip package

LIU TSANG-YU3 citations60

LIN TA-HSUAN

1 patent

US8633558B2Jan 21, 2014

Package structure for a chip and method for fabricating the same

LIN TA-HSUAN2 citations53

LIN PO-SHEN

1 patent

US8836134B2Sep 16, 2014

Semiconductor stacked package and method of fabricating the same

LIN PO-SHEN1 citations48

HUNG TZU-HSIANG

1 patent

US8779452B2Jul 15, 2014

Chip package

HUNG TZU-HSIANG1 citations45