Inventor
LO TENG-YUAN
TW15 patents
Patents
15 patentsUS11508656B2Nov 22, 2022
Semiconductor package and method
TAIWAN SEMICONDUCTOR MFG CO LTD8 citations85
US11450581B2Sep 20, 2022
Integrated circuit package and method
TAIWAN SEMICONDUCTOR MFG CO LTD11 citations85
US10510686B2Dec 17, 2019
Semiconductor package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations83
US11646255B2May 9, 2023
Chip package structure including a silicon substrate interposer and methods for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11049805B2Jun 29, 2021
Semiconductor package and method
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11984372B2May 14, 2024
Integrated circuit package and method
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US10797008B2Oct 6, 2020
Semiconductor package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations72
US10734328B2Aug 4, 2020
Semiconductor package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations72
US10461023B2Oct 29, 2019
Semiconductor packages and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations70
US12261092B2Mar 25, 2025
Semiconductor package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations64
US12588549B2Mar 24, 2026
Integrated circuit package and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12014979B2Jun 18, 2024
Methods of forming semiconductor packages
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12014976B2Jun 18, 2024
Chip package structure including a silicon substrate interposer and methods for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11508671B2Nov 22, 2022
Semiconductor package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10985115B2Apr 20, 2021
Semiconductor package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62