Inventor
CADY JAMES W
US39 patents
⚠️ This page may combine multiple inventors who share the name “CADY JAMES W”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
STAKTEK GROUP LP
16 patentsUS7180167B2Feb 20, 2007
Low profile stacking system and method
STAKTEK GROUP LP61 citations98
US6956284B2Oct 18, 2005
Integrated circuit stacking system and method
STAKTEK GROUP LP88 citations98
US6576992B1Jun 10, 2003
Chip scale stacking system and method
STAKTEK GROUP LP162 citations98
US7066741B2Jun 27, 2006
Flexible circuit connector for stacked chip module
STAKTEK GROUP LP78 citations97
US7053478B2May 30, 2006
Pitch change and chip scale stacking system
STAKTEK GROUP LP139 citations97
US7026708B2Apr 11, 2006
Low profile chip scale stacking system and method
STAKTEK GROUP LP79 citations97
US6914324B2Jul 5, 2005
Memory expansion and chip scale stacking system and method
STAKTEK GROUP LP98 citations97
US6572387B2Jun 3, 2003
Flexible circuit connector for stacked chip module
STAKTEK GROUP LP100 citations97
US7094632B2Aug 22, 2006
Low profile chip scale stacking system and method
STAKTEK GROUP LP51 citations96
US6940729B2Sep 6, 2005
Integrated circuit stacking system and method
STAKTEK GROUP LP37 citations95
US6955945B2Oct 18, 2005
Memory expansion and chip scale stacking system and method
STAKTEK GROUP LP13 citations92
US6194247B1Feb 27, 2001
Warp-resistent ultra-thin integrated circuit package fabrication method
STAKTEK GROUP LP27 citations92
US6404662B1Jun 11, 2002
Rambus stakpak
STAKTEK GROUP LP19 citations84
US7335975B2Feb 26, 2008
Integrated circuit stacking system and method
STAKTEK GROUP LP4 citations73
US7256484B2Aug 14, 2007
Memory expansion and chip scale stacking system and method
STAKTEK GROUP LP3 citations62
US7202555B2Apr 10, 2007
Pitch change and chip scale stacking system and method
STAKTEK GROUP LP2 citations61
ENTORIAN TECHNOLOGIES LP
9 patentsUS7595550B2Sep 29, 2009
Flex-based circuit module
ENTORIAN TECHNOLOGIES LP36 citations96
US7423885B2Sep 9, 2008
Die module system
ENTORIAN TECHNOLOGIES LP15 citations84
US7602613B2Oct 13, 2009
Thin module system and method
ENTORIAN TECHNOLOGIES LP9 citations79
US7606049B2Oct 20, 2009
Module thermal management system and method
ENTORIAN TECHNOLOGIES LP7 citations74
US7606050B2Oct 20, 2009
Compact module system and method
ENTORIAN TECHNOLOGIES LP7 citations74
US7524703B2Apr 28, 2009
Integrated circuit stacking system and method
ENTORIAN TECHNOLOGIES LP7 citations74
US7586758B2Sep 8, 2009
Integrated circuit stacking system
ENTORIAN TECHNOLOGIES LP6 citations73
US7495334B2Feb 24, 2009
Stacking system and method
ENTORIAN TECHNOLOGIES LP6 citations73
US7542304B2Jun 2, 2009
Memory expansion and integrated circuit stacking system and method
ENTORIAN TECHNOLOGIES LP1 citations52
STAKTEK CORP
8 patentsUS5550711AAug 27, 1996
Ultra high density integrated circuit packages
STAKTEK CORP164 citations98
USRE36229EJun 15, 1999
Simulcast standard multichip memory addressing system
STAKTEK CORP57 citations96
US5446620AAug 29, 1995
Ultra high density integrated circuit packages
STAKTEK CORP95 citations96
US5369058ANov 29, 1994
Warp-resistent ultra-thin integrated circuit package fabrication method
STAKTEK CORP40 citations95
US5369056ANov 29, 1994
Warp-resistent ultra-thin integrated circuit package fabrication method
STAKTEK CORP43 citations95
US5367766ANov 29, 1994
Ultra high density integrated circuit packages method
STAKTEK CORP87 citations95
US5371866ADec 6, 1994
Simulcast standard multichip memory addressing system
STAKTEK CORP43 citations93
US5581121ADec 3, 1996
Warp-resistant ultra-thin integrated circuit package
STAKTEK CORP19 citations92