Inventor
KOTANI HIDEO
JP5 patents
Patents
5 patentsUS4977105ADec 11, 1990
Method for manufacturing interconnection structure in semiconductor device
MITSUBISHI ELECTRIC CORP83 citations94
US5250468AOct 5, 1993
Method of manufacturing semiconductor device including interlaying insulating film
MITSUBISHI ELECTRIC CORP21 citations91
US5132774AJul 21, 1992
Semiconductor device including interlayer insulating film
MITSUBISHI ELECTRIC CORP29 citations91
US4872050AOct 3, 1989
Interconnection structure in semiconductor device and manufacturing method of the same
MITSUBISHI ELECTRIC CORP26 citations91
US4411929AOct 25, 1983
Method for manufacturing semiconductor device
MITSUBISHI ELECTRIC CORP6 citations71