Inventor
ITO HISATAKA
JP29 patents
⚠️ This page may combine multiple inventors who share the name “ITO HISATAKA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NITTO DENKO CORP
14 patentsUS5990546ANov 23, 1999
Chip scale package type of semiconductor device
NITTO DENKO CORP187 citations98
US5814894ASep 29, 1998
Semiconductor device, production method thereof, and tape carrier for semiconductor device used for producing the semiconductor device
NITTO DENKO CORP205 citations97
US7307286B2Dec 11, 2007
Epoxy resin composition for encapsulating optical semiconductor element and optical semiconductor device using the same
NITTO DENKO CORP17 citations83
US9080103B2Jul 14, 2015
Phosphor layer attaching kit, optical semiconductor element-phosphor layer attaching body, and optical semiconductor device
NITTO DENKO CORP5 citations72
US7265167B2Sep 4, 2007
Epoxy resin composition for semiconductor encapsulation, and semiconductor device using the same
NITTO DENKO CORP2 citations61
US8017670B2Sep 13, 2011
Epoxy resin composition for optical-semiconductor encapsulation, cured resin thereof, and optical semiconductor device obtained with the same
NITTO DENKO CORP3 citations60
US6852263B2Feb 8, 2005
Semiconductor device and process for producing the same, and tablet comprising epoxy resin composition
NITTO DENKO CORP4 citations58
US6646063B2Nov 11, 2003
Semiconductor device and process for producing the same, and tablet comprising epoxy resin composition
NITTO DENKO CORP3 citations58
US7345102B2Mar 18, 2008
Epoxy resin composition for encapsulating optical semiconductor element and optical semiconductor device using the same
NITTO DENKO CORP1 citations52
US9450160B2Sep 20, 2016
Reflecting resin sheet, light emitting diode device and producing method thereof
NITTO DENKO CORP0 citations51
US7986050B2Jul 26, 2011
Epoxy resin composition for optical semiconductor element encapsulation and optical semiconductor device using the same
NITTO DENKO CORP1 citations48
US6933618B2Aug 23, 2005
Tablet comprising epoxy resin composition
NITTO DENKO CORP0 citations47
US9117984B2Aug 25, 2015
Encapsulating layer-covered optical semiconductor element, producing method thereof, and optical semiconductor device
NITTO DENKO CORP0 citations42
US7674865B2Mar 9, 2010
Photosemiconductor encapsulant of epoxy resin, anhydride and aromatic silicone resin
NITTO DENKO CORP0 citations41
OOYABU YASUNARI
6 patentsUS9412920B2Aug 9, 2016
Phosphor reflecting sheet, light emitting diode device, and producing method thereof
OOYABU YASUNARI5 citations72
US8796712B2Aug 5, 2014
Phosphor layer and light-emitting device
OOYABU YASUNARI4 citations71
US9214611B2Dec 15, 2015
Reflecting resin sheet, light emitting diode device and producing method thereof
OOYABU YASUNARI3 citations62
US8916893B2Dec 23, 2014
Light-emitting device
OOYABU YASUNARI3 citations62
US8664678B2Mar 4, 2014
Phosphor ceramic and light-emitting device
OOYABU YASUNARI2 citations62
US8716733B2May 6, 2014
Transfer sheet for phosphor layer and light-emitting device
OOYABU YASUNARI0 citations52
ITO HISATAKA
3 patentsUS9608178B2Mar 28, 2017
Semiconductor light emitting device
ITO HISATAKA2 citations70
US8890190B2Nov 18, 2014
Light-emitting diode element in which an optical semiconductor element is encapsulated by an encapsulating resin layer containing a light reflection component
ITO HISATAKA0 citations49
US8642362B2Feb 4, 2014
Method for producing light-emitting diode device
ITO HISATAKA0 citations49
SATO SATOSHI
2 patentsTANIGUCHI TAKASHI
2 patentsUS8319228B2Nov 27, 2012
Resin composition for optical semiconductor device, optical-semiconductor-device lead frame obtained using the same, and optical semiconductor device
TANIGUCHI TAKASHI0 citations49
US8664685B2Mar 4, 2014
Resin composition for optical semiconductor element housing package, and optical semiconductor light-emitting device obtained using the same
TANIGUCHI TAKASHI0 citations43