P

Inventor

KUHN KELIN J

US79 patents
⚠️ This page may combine multiple inventors who share the name “KUHN KELIN J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

INTEL CORP

25 patents
US6368931B1Apr 9, 2002

Thin tensile layers in shallow trench isolation and method of making same

INTEL CORP283 citations99
US9343559B2May 17, 2016

Nanowire transistor devices and forming techniques

INTEL CORP25 citations94
US9859368B2Jan 2, 2018

Integration methods to fabricate internal spacers for nanowire devices

INTEL CORP11 citations93
US9472613B2Oct 18, 2016

Conversion of strain-inducing buffer to electrical insulator

INTEL CORP13 citations93
US7312485B2Dec 25, 2007

CMOS fabrication process utilizing special transistor orientation

INTEL CORP21 citations92
US6627506B2Sep 30, 2003

Thin tensile layers in shallow trench isolation and method of making same

INTEL CORP23 citations92
US10074573B2Sep 11, 2018

CMOS nanowire structure

INTEL CORP8 citations84
US9812524B2Nov 7, 2017

Nanowire transistor devices and forming techniques

INTEL CORP13 citations84
US9691843B2Jun 27, 2017

Common-substrate semiconductor devices having nanowires or semiconductor bodies with differing material orientation or composition

INTEL CORP7 citations84
US9595581B2Mar 14, 2017

Silicon and silicon germanium nanowire structures

INTEL CORP7 citations84
US10026829B2Jul 17, 2018

Semiconductor device with isolated body portion

INTEL CORP8 citations83
US9893167B2Feb 13, 2018

Integration methods to fabricate internal spacers for nanowire devices

INTEL CORP9 citations82
US9508796B2Nov 29, 2016

Internal spacers for nanowire transistors and method of fabrication thereof

INTEL CORP9 citations82
US7737770B2Jun 15, 2010

Power switches having positive-channel high dielectric constant insulated gate field effect transistors

INTEL CORP9 citations82
US11581406B2Feb 14, 2023

Method of fabricating CMOS FinFETs by selectively etching a strained SiGe layer

INTEL CORP1 citations73
US11195919B2Dec 7, 2021

Method of fabricating a semiconductor device with strained SiGe fins and a Si cladding layer

INTEL CORP1 citations73
US10580860B2Mar 3, 2020

Integration methods to fabricate internal spacers for nanowire devices

INTEL CORP1 citations73
US9935107B2Apr 3, 2018

CMOS FinFET device with dual strained cladding layers on relaxed SiGe fins, and method of fabricating the same

INTEL CORP6 citations73
US9911835B2Mar 6, 2018

Tunneling field effect transistors (TFETs) for CMOS architectures and approaches to fabricating N-type and P-type TFETs

INTEL CORP2 citations73
US9673302B2Jun 6, 2017

Conversion of strain-inducing buffer to electrical insulator

INTEL CORP2 citations73
US9258114B2Feb 9, 2016

Quantum key distribution (QSD) scheme using photonic integrated circuit (PIC)

INTEL CORP3 citations73
US7999607B2Aug 16, 2011

Power switches having positive-channel high dielectric constant insulated gate field effect transistors

INTEL CORP5 citations72
US10593804B2Mar 17, 2020

Non-planar semiconductor device having hybrid geometry-based active region

INTEL CORP1 citations71
US10586868B2Mar 10, 2020

Non-planar semiconductor device having hybrid geometry-based active region

INTEL CORP1 citations71
US9935205B2Apr 3, 2018

Internal spacers for nanowire transistors and method of fabrication thereof

INTEL CORP3 citations71

CAPPELLANI ANNALISA

6 patents

KUHN KELIN J

4 patents

KIM SEIYON

3 patents

CEA STEPHEN M

3 patents

SONY GROUP CORP

3 patents

GLASS GLENN A

1 patent

TRUSTEES LELAND STANFORD UNIVE

1 patent

KOTLYAR ROZA

1 patent

UNIV LELAND STANFORD JUNIOR

1 patent

MANIPATRUNI SASIKANTH

1 patent

GOOGLE LLC

1 patent

Showing the top 50 of 79 patents by PatentIndex Score.