Inventor
KUHN KELIN J
US79 patents
⚠️ This page may combine multiple inventors who share the name “KUHN KELIN J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
25 patentsUS6368931B1Apr 9, 2002
Thin tensile layers in shallow trench isolation and method of making same
INTEL CORP283 citations99
US9343559B2May 17, 2016
Nanowire transistor devices and forming techniques
INTEL CORP25 citations94
US9859368B2Jan 2, 2018
Integration methods to fabricate internal spacers for nanowire devices
INTEL CORP11 citations93
US9472613B2Oct 18, 2016
Conversion of strain-inducing buffer to electrical insulator
INTEL CORP13 citations93
US7312485B2Dec 25, 2007
CMOS fabrication process utilizing special transistor orientation
INTEL CORP21 citations92
US6627506B2Sep 30, 2003
Thin tensile layers in shallow trench isolation and method of making same
INTEL CORP23 citations92
US10074573B2Sep 11, 2018
CMOS nanowire structure
INTEL CORP8 citations84
US9812524B2Nov 7, 2017
Nanowire transistor devices and forming techniques
INTEL CORP13 citations84
US9691843B2Jun 27, 2017
Common-substrate semiconductor devices having nanowires or semiconductor bodies with differing material orientation or composition
INTEL CORP7 citations84
US9595581B2Mar 14, 2017
Silicon and silicon germanium nanowire structures
INTEL CORP7 citations84
US10026829B2Jul 17, 2018
Semiconductor device with isolated body portion
INTEL CORP8 citations83
US9893167B2Feb 13, 2018
Integration methods to fabricate internal spacers for nanowire devices
INTEL CORP9 citations82
US9508796B2Nov 29, 2016
Internal spacers for nanowire transistors and method of fabrication thereof
INTEL CORP9 citations82
US7737770B2Jun 15, 2010
Power switches having positive-channel high dielectric constant insulated gate field effect transistors
INTEL CORP9 citations82
US11581406B2Feb 14, 2023
Method of fabricating CMOS FinFETs by selectively etching a strained SiGe layer
INTEL CORP1 citations73
US11195919B2Dec 7, 2021
Method of fabricating a semiconductor device with strained SiGe fins and a Si cladding layer
INTEL CORP1 citations73
US10580860B2Mar 3, 2020
Integration methods to fabricate internal spacers for nanowire devices
INTEL CORP1 citations73
US9935107B2Apr 3, 2018
CMOS FinFET device with dual strained cladding layers on relaxed SiGe fins, and method of fabricating the same
INTEL CORP6 citations73
US9911835B2Mar 6, 2018
Tunneling field effect transistors (TFETs) for CMOS architectures and approaches to fabricating N-type and P-type TFETs
INTEL CORP2 citations73
US9673302B2Jun 6, 2017
Conversion of strain-inducing buffer to electrical insulator
INTEL CORP2 citations73
US9258114B2Feb 9, 2016
Quantum key distribution (QSD) scheme using photonic integrated circuit (PIC)
INTEL CORP3 citations73
US7999607B2Aug 16, 2011
Power switches having positive-channel high dielectric constant insulated gate field effect transistors
INTEL CORP5 citations72
US10593804B2Mar 17, 2020
Non-planar semiconductor device having hybrid geometry-based active region
INTEL CORP1 citations71
US10586868B2Mar 10, 2020
Non-planar semiconductor device having hybrid geometry-based active region
INTEL CORP1 citations71
US9935205B2Apr 3, 2018
Internal spacers for nanowire transistors and method of fabrication thereof
INTEL CORP3 citations71
CAPPELLANI ANNALISA
6 patentsUS9608059B2Mar 28, 2017
Semiconductor device with isolated body portion
CAPPELLANI ANNALISA18 citations92
US9129827B2Sep 8, 2015
Conversion of strain-inducing buffer to electrical insulator
CAPPELLANI ANNALISA12 citations84
US10424580B2Sep 24, 2019
Semiconductor devices having modulated nanowire counts
CAPPELLANI ANNALISA6 citations73
US9559160B2Jan 31, 2017
Common-substrate semiconductor devices having nanowires or semiconductor bodies with differing material orientation or composition
CAPPELLANI ANNALISA5 citations73
US9425212B2Aug 23, 2016
Isolated and bulk semiconductor devices formed on a same bulk substrate
CAPPELLANI ANNALISA3 citations73
US9029221B2May 12, 2015
Semiconductor devices having three-dimensional bodies with modulated heights
CAPPELLANI ANNALISA4 citations70
KUHN KELIN J
4 patentsUS8753942B2Jun 17, 2014
Silicon and silicon germanium nanowire structures
KUHN KELIN J144 citations98
US9129829B2Sep 8, 2015
Silicon and silicon germanium nanowire structures
KUHN KELIN J62 citations97
US8258057B2Sep 4, 2012
Copper-filled trench contact for transistor performance improvement
KUHN KELIN J53 citations96
US8766372B2Jul 1, 2014
Copper-filled trench contact for transistor performance improvement
KUHN KELIN J15 citations91
KIM SEIYON
3 patentsCEA STEPHEN M
3 patentsUS8558279B2Oct 15, 2013
Non-planar device having uniaxially strained semiconductor body and method of making same
CEA STEPHEN M15 citations92
US9564522B2Feb 7, 2017
Nanowire structures having non-discrete source and drain regions
CEA STEPHEN M6 citations84
US9087863B2Jul 21, 2015
Nanowire structures having non-discrete source and drain regions
CEA STEPHEN M10 citations84
SONY GROUP CORP
3 patentsUS12513958B2Dec 30, 2025
Nanowire transistor fabrication with hardmask layers
SONY GROUP CORP0 citations63
US12363967B2Jul 15, 2025
Integration methods to fabricate internal spacers for nanowire devices
SONY GROUP CORP0 citations63
US12142634B2Nov 12, 2024
Silicon and silicon germanium nanowire structures
SONY GROUP CORP0 citations63
GLASS GLENN A
1 patentTRUSTEES LELAND STANFORD UNIVE
1 patentKOTLYAR ROZA
1 patentUNIV LELAND STANFORD JUNIOR
1 patentMANIPATRUNI SASIKANTH
1 patentGOOGLE LLC
1 patentShowing the top 50 of 79 patents by PatentIndex Score.