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Inventor

LUO LIXIONG

US5 patents
⚠️ This page may combine multiple inventors who share the name “LUO LIXIONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SILICONIX INC

3 patents
US6249041B1Jun 19, 2001

IC chip package with directly connected leads

SILICONIX INC196 citations97
US6744124B1Jun 1, 2004

Semiconductor die package including cup-shaped leadframe

SILICONIX INC75 citations96
US6909170B2Jun 21, 2005

Semiconductor assembly with package using cup-shaped lead-frame

SILICONIX INC6 citations72

VISHAY SILICONIX

1 patent
US7595547B1Sep 29, 2009

Semiconductor die package including cup-shaped leadframe

VISHAY SILICONIX0 citations51

CHANG MIKE

1 patent
US9040356B2May 26, 2015

Semiconductor including cup-shaped leadframe packaging techniques

CHANG MIKE0 citations44