Inventor

WINDERL JOHANN

DE13 patents

Patents

13 patents

US6614100B1Sep 2, 2003

Lead frame for the installation of an integrated circuit in an injection-molded package

INFINEON TECHNOLOGIES AG19 citations92

US6525416B2Feb 25, 2003

Electronic devices and a sheet strip for packaging bonding wire connections of electronic devices and method for producing them

INFINEON TECHNOLOGIES AG32 citations92

US6521988B2Feb 18, 2003

Device for packaging electronic components

INFINEON TECHNOLOGIES AG21 citations92

US6894378B2May 17, 2005

Electronic component with stacked semiconductor chips

INFINEON TECHNOLOGIES AG23 citations91

US6534345B1Mar 18, 2003

Method for mounting a semiconductor chip on a carrier layer and device for carrying out the method

INFINEON TECHNOLOGIES AG15 citations83

US6664648B2Dec 16, 2003

Apparatus for applying a semiconductor chip to a carrier element with a compensating layer

INFINEON TECHNOLOGIES AG10 citations73

US6486538B1Nov 26, 2002

Chip carrier having ventilation channels

INFINEON TECHNOLOGIES AG7 citations73

US6364751B1Apr 2, 2002

Method for singling semiconductor components and semiconductor component singling device

INFINEON TECHNOLOGIES AG11 citations73

US6430809B1Aug 13, 2002

Method for bonding conductors, in particular beam leads

INFINEON TECHNOLOGIES AG9 citations71

US7008493B2Mar 7, 2006

Method for applying a semiconductor chip to a carrier element

INFINEON TECHNOLOGIES AG0 citations51

US6891252B2May 10, 2005

Electronic component with a semiconductor chip and method of producing an electronic component

INFINEON TECHNOLOGIES AG0 citations48

US7036216B2May 2, 2006

Method and apparatus for connecting at least one chip to an external wiring configuration

INFINEON TECHNOLOGIES AG0 citations41

US6429537B2Aug 6, 2002

Semiconductor component with method for manufacturing

INFINEON TECHNOLOGIES AG0 citations39