Inventor

SU YUAN-CHANG

TW30 patents

⚠️ This page may combine multiple inventors who share the name “SU YUAN-CHANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SU YUAN-CHANG

ADVANCED SEMICONDUCTOR ENG

Semiconductor package structure and semiconductor process

Semiconductor package with single sided substrate design and manufacturing methods thereof

Substrate having single patterned metal layer exposing patterned dielectric layer, chip package structure including the substrate, and manufacturing methods thereof

Semiconductor substrate mitigating bridging

Double side via last method for double embedded patterned substrate

Substrate, semiconductor package structure and manufacturing process

Double side via last method for double embedded patterned substrate

Semiconductor substrate and method for making the same

Semiconductor substrate and method for manufacturing the same

Semiconductor package with single sided substrate design and manufacturing methods thereof

Semiconductor package and process for fabricating same

Circuit board, and chip package structure

Substrate for packaging a semiconductor device package and a method of manufacturing the same

Semiconductor package structure and semiconductor process

Package carrier, semiconductor package, and process for fabricating same

Semiconductor package including dielectric layers defining via holes extending to component pads

Semiconductor substrate, semiconductor package structure and method of making the same

Semiconductor substrate, semiconductor package structure and method of making the same

Semiconductor device package and a method of manufacturing the same

SU YUAN-CHANG

Embedded component substrate and manufacturing methods thereof

Semiconductor package with single sided substrate design and manufacturing methods thereof

Embedded component package structure

Semiconductor package and process for fabricating same

APPELT BERND KARL

Substrate having single patterned metal layer, and package applied with the substrate , and methods of manufacturing of the substrate and package

Method of fabricating multi-layered substrate

Leadframe package structure and manufacturing method thereof

LEE CHUN-CHE

Embedded component device and manufacturing methods thereof

HUANG SHIH-FU

Semiconductor package with substrate having single metal layer and manufacturing methods thereof

SUBTRON TECHNOLOGY CO LTD

Layer build-up method for manufacturing multi-layer board

CHEN KUANG-HSIUNG

Semiconductor package