Inventor
HUANG SHIH-FU
TW22 patents
⚠️ This page may combine multiple inventors who share the name “HUANG SHIH-FU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ADVANCED SEMICONDUCTOR ENG
6 patentsUS8884424B2Nov 11, 2014
Semiconductor package with single sided substrate design and manufacturing methods thereof
ADVANCED SEMICONDUCTOR ENG12 citations83
US8367473B2Feb 5, 2013
Substrate having single patterned metal layer exposing patterned dielectric layer, chip package structure including the substrate, and manufacturing methods thereof
ADVANCED SEMICONDUCTOR ENG12 citations82
US9196597B2Nov 24, 2015
Semiconductor package with single sided substrate design and manufacturing methods thereof
ADVANCED SEMICONDUCTOR ENG2 citations62
US9165900B2Oct 20, 2015
Semiconductor package and process for fabricating same
ADVANCED SEMICONDUCTOR ENG2 citations61
US8357861B2Jan 22, 2013
Circuit board, and chip package structure
ADVANCED SEMICONDUCTOR ENG2 citations61
US9564346B2Feb 7, 2017
Package carrier, semiconductor package, and process for fabricating same
ADVANCED SEMICONDUCTOR ENG1 citations52
RAYMX MICROELECTRONICS CORP
5 patentsUS10672499B2Jun 2, 2020
NAND flash memory controller and storage apparatus applying the same
RAYMX MICROELECTRONICS CORP2 citations70
US10956087B2Mar 23, 2021
Memory controller having temperature dependent data program scheme and related method
RAYMX MICROELECTRONICS CORP0 citations51
US11055023B2Jul 6, 2021
Electronic device, related controller circuit and method
RAYMX MICROELECTRONICS CORP0 citations50
US11449310B2Sep 20, 2022
Random number generator, encryption/decryption secret key generator and method based on characteristics of memory cells
RAYMX MICROELECTRONICS CORP0 citations49
US10705743B2Jul 7, 2020
Memory control device, control method of flash memory, and method for generating security feature of flash memory
RAYMX MICROELECTRONICS CORP0 citations49
SU YUAN-CHANG
4 patentsUS8320134B2Nov 27, 2012
Embedded component substrate and manufacturing methods thereof
SU YUAN-CHANG35 citations92
US8569894B2Oct 29, 2013
Semiconductor package with single sided substrate design and manufacturing methods thereof
SU YUAN-CHANG27 citations91
US8284561B2Oct 9, 2012
Embedded component package structure
SU YUAN-CHANG16 citations83
US8786062B2Jul 22, 2014
Semiconductor package and process for fabricating same
SU YUAN-CHANG8 citations82