Inventor

CHEN KUANG-HSIUNG

TW43 patents

⚠️ This page may combine multiple inventors who share the name “CHEN KUANG-HSIUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHEN KUANG-HSIUNG

ADVANCED SEMICONDUCTOR ENG

Semiconductor package with single sided substrate design and manufacturing methods thereof

Semiconductor device package with a conductive post

Semiconductor device package and method of manufacturing the same

Substrate having single patterned metal layer exposing patterned dielectric layer, chip package structure including the substrate, and manufacturing methods thereof

Substrate having a conductive structure within photo-sensitive resin

Semiconductor substrate and semiconductor package structure

Semiconductor device package and method for manufacturing the same

Semiconductor device package and method of manufacturing the same

Semiconductor package device having glass transition temperature greater than binding layer temperature

Semiconductor device package and method of manufacturing the same

Semiconductor device with a conductive post

Optical module and method of making the same

Optical module and method of making the same

Optical module and method of making the same

Semiconductor package with single sided substrate design and manufacturing methods thereof

Semiconductor package and process for fabricating same

Device including a plurality of leads surrounding a die paddle and method for manufacturing the same

Substrate structure, semiconductor package structure and method for manufacturing semiconductor package structure

Semiconductor device package and method for manufacturing the same

Optical module and method of making the same

Semiconductor package device having glass transition temperature greater than binding layer temperature

Semiconductor package structure and fabrication method thereof

Semiconductor substrate and manufacturing method thereof

Semiconductor package structure and fabrication method thereof

Heat dissipating semiconductor device packages and related methods

Semiconductor package substrates having pillars and related methods

Semiconductor package and method of manufacturing the same

Semi-finished package and method for making a package

Substrate, semiconductor package thereof and process of making same

Semiconductor substrate structure, semiconductor package and method of manufacturing the same

CHEN KUANG-HSIUNG

Stackable semiconductor device packages including openings partially exposing connecting elements, conductive bumps, or conductive conductors

Semiconductor package

Heat dissipating semiconductor device packages

Semiconductor device packages with protective layer and related methods

Package structure and package substrate thereof

SU YUAN-CHANG

Semiconductor package with single sided substrate design and manufacturing methods thereof

Semiconductor package and process for fabricating same

SUN YU-CHING

Semiconductor device packages having a side-by-side device arrangement and stacking functionality

Semiconductor package and the method of making the same

HUANG SHIH-FU

Semiconductor package with substrate having single metal layer and manufacturing methods thereof

APPELT BERND KARL

Leadframe package structure and manufacturing method thereof

JENG REN YIH

Reinforced assembly carrier

HSU YUEH-CHEN

Leadframe and chip package