Inventor

LEE MING CHIANG

TW25 patents

⚠️ This page may combine multiple inventors who share the name “LEE MING CHIANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LEE MING CHIANG

ADVANCED SEMICONDUCTOR ENG

Wafer-level semiconductor device packages with three-dimensional fan-out and manufacturing methods thereof

Micro-electro-mechanical-system package and method for manufacturing the same

Semiconductor package structure and semiconductor process

Semiconductor package with single sided substrate design and manufacturing methods thereof

Semiconductor substrate mitigating bridging

Semiconductor device package and method of manufacturing the same

Flip chip package process

Semiconductor device package

Semiconductor substrate and method for manufacturing the same

Semiconductor package with single sided substrate design and manufacturing methods thereof

Quad flat non-leaded package and manufacturing method thereof

Substrate structure and package structure using the same

SU YUAN-CHANG

Embedded component substrate and manufacturing methods thereof

Semiconductor package with single sided substrate design and manufacturing methods thereof

Embedded component package structure

WANG CHIEN-HAO

Coreless substrate and method for making the same

Manufacturing method of embedded circuit substrate

LEE CHUN-CHE

Embedded component device and manufacturing methods thereof

HUANG SHIH-FU

Semiconductor package with substrate having single metal layer and manufacturing methods thereof

ESSIG KAY STEPHAN

Semiconductor package with embedded die and manufacturing methods thereof

CHEN MIN-YAO

Method of fabricating a multi-trace via substrate

APPELT BERND KARL

Method of fabricating multi-layered substrate

CHEN KUO-HUA

Substrate structure and package structure using the same

LEE MING-CHIANG

Chip package

TONG HO-MING

Thermally enhanced package structure