Inventor

APPELT BERND KARL

US68 patents

⚠️ This page may combine multiple inventors who share the name “APPELT BERND KARL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

APPELT BERND KARL

ADVANCED SEMICONDUCTOR ENG

Overmolded optical package

Semiconductor package and method for manufacturing a semiconductor package

Semiconductor package device and method of manufacturing the same

Semiconductor package and semiconductor process

Semiconductor package with single sided substrate design and manufacturing methods thereof

Semiconductor device package and method for manufacturing the same

Semiconductor device package and method of manufacturing the same

Electronic package and method for manufacturing the same

Semiconductor device package and method for manufacturing the same

Semiconductor device package and method of manufacturing the same

Method for manufacturing an adhesive substrate with a die-cavity sidewall

Method for manufacturing a semiconductor package with a laminated chip cavity

Electronic package including a protection layer

Semiconductor package structure and method for manufacturing the same

Electronic package and method of manufacturing the same

Electronic package, semiconductor package structure, and method for manufacturing the semiconductor package structure

Semiconductor device package, antenna device, and method for manufacturing the same

Substrate structure, package structure and method for manufacturing electronic package structure

Semiconductor package structure and method for manufacturing the same

Semiconductor device package

Leadframe including conductive pillar over land of conductive layer

Semiconductor package

Substrate structure, semiconductor package structure and method for manufacturing a substrate structure

Semiconductor device including metal holder and method of manufacturing the same

Semiconductor package and method of manufacturing the same

Semiconductor package with single sided substrate design and manufacturing methods thereof

IBM

Die attachment with reduced adhesive bleed-out

Dustfree prepreg and method for making an article based thereon

Method of filling an aperture in a substrate

Dustfree prepreg and method for making an article based thereon

Technique for forming resin-impregnated fiberglass sheets

Technique for forming resin-imprenated fiberglass sheets with improved resistance to pinholing

Technique for forming resin-impregnated fiberglass sheets with improved resistance to pinholing

Technique for forming resin-impregnated fiberglass sheets using multiple resins

Technique for forming resin-impregnated fiberglass sheets

Technique for forming resin-impregnated fiberglass sheets with improved resistance to pinholing

Process for filling apertures in a circuit board or chip carrier

Dustfree prepreg and method for making an article based thereon

Technique for forming resin-impregnated fiberglass sheets

Technique for forming resin-impregnated fiberglass sheets with improved resistance to pinholing

Technique for forming resin-impregnated fiberglass sheets using multiple resins

Method of rendering a substrate selectively non-wettable chip carrier with enhanced wire bondability

Dustfree prepreg and method for making an article based thereon

SU YUAN-CHANG

Semiconductor package with single sided substrate design and manufacturing methods thereof

Embedded component package structure

APPELT BERND KARL

Embedded component substrate, semiconductor package structure using the same and fabrication methods thereof

Substrate having single patterned metal layer, and package applied with the substrate , and methods of manufacturing of the substrate and package

HUANG SHIH-FU

Semiconductor package with substrate having single metal layer and manufacturing methods thereof

INT BUSINESS MACJINES COPORATI

Technique for forming resin-impregnated fiberglass sheets using multiple resins

ESSIG KAY STEPHAN

Semiconductor package with embedded die and manufacturing methods thereof