Inventor
XIU YONGHAO
US9 patents
⚠️ This page may combine multiple inventors who share the name “XIU YONGHAO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
6 patentsUS9431274B2Aug 30, 2016
Method for reducing underfill filler settling in integrated circuit packages
INTEL CORP2 citations59
US9611372B2Apr 4, 2017
Narrow-gap flip chip underfill composition
INTEL CORP1 citations51
US9269596B2Feb 23, 2016
Narrow-gap flip chip underfill composition
INTEL CORP1 citations51
US9230833B2Jan 5, 2016
Methods to prevent filler entrapment in microelectronic device to microelectronic substrate interconnection structures
INTEL CORP0 citations51
US8999765B2Apr 7, 2015
Methods to prevent filler entrapment in microelectronic device to microelectronic substrate interconnection structures
INTEL CORP1 citations51
US10115606B2Oct 30, 2018
Methods of promoting adhesion between underfill and conductive bumps and structures formed thereby
INTEL CORP0 citations49