Inventor
ANANTHAKRISHNAN NISHA
US22 patents
⚠️ This page may combine multiple inventors who share the name “ANANTHAKRISHNAN NISHA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
17 patentsUS11282717B2Mar 22, 2022
Micro-electronic package with substrate protrusion to facilitate dispense of underfill between a narrow die-to-die gap
INTEL CORP2 citations69
US8900919B2Dec 2, 2014
Robust ink formulations for durable markings on microelectronic packages and its extendibility as a barrier material for thermal and sealant materials
INTEL CORP2 citations60
US12417958B2Sep 16, 2025
Microelectronics package comprising a package-on-package (PoP) architecture with inkjet barrier material for controlling bondline thickness and PoP adhesive keep out zone
INTEL CORP0 citations59
US12347743B2Jul 1, 2025
Microelectronics package comprising a package-on-package (PoP) architecture with inkjet barrier material for controlling bondline thickness and pop adhesive keep out zone
INTEL CORP0 citations59
US12315777B2May 27, 2025
Microelectronics package comprising a package-on-package (POP) architecture with inkjet barrier material for controlling bondline thickness and POP adhesive keep out zone
INTEL CORP0 citations59
US11776821B2Oct 3, 2023
Micro-electronic package with substrate protrusion to facilitate dispense of underfill between a narrow die-to-die gap
INTEL CORP0 citations59
US9431274B2Aug 30, 2016
Method for reducing underfill filler settling in integrated circuit packages
INTEL CORP2 citations59
US11804470B2Oct 31, 2023
Wafer level passive heat spreader interposer to enable improved thermal solution for stacked dies in multi-chips package and warpage control
INTEL CORP0 citations58
US9611372B2Apr 4, 2017
Narrow-gap flip chip underfill composition
INTEL CORP1 citations51
US9458283B2Oct 4, 2016
Flexible underfill compositions for enhanced reliability
INTEL CORP0 citations51
US9269596B2Feb 23, 2016
Narrow-gap flip chip underfill composition
INTEL CORP1 citations51
US9704767B1Jul 11, 2017
Mold compound with reinforced fibers
INTEL CORP0 citations50
US10115606B2Oct 30, 2018
Methods of promoting adhesion between underfill and conductive bumps and structures formed thereby
INTEL CORP0 citations49
US9640415B2May 2, 2017
Robust ink formulations for durable markings on microelectronic packages and its extendibility as a barrier material for thermal and sealant materials
INTEL CORP0 citations49
US9631065B2Apr 25, 2017
Methods of forming wafer level underfill materials and structures formed thereby
INTEL CORP1 citations48
US7759780B2Jul 20, 2010
Microelectronic package with wear resistant coating
INTEL CORP0 citations47
US10475715B2Nov 12, 2019
Two material high K thermal encapsulant system
INTEL CORP0 citations36