Inventor

KRISHNAN ARJUN

US17 patents

⚠️ This page may combine multiple inventors who share the name “KRISHNAN ARJUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KRISHNAN ARJUN

INTEL CORP

Stiffener tape for electronic assembly that includes wafer or panel

Robust ink formulations for durable markings on microelectronic packages and its extendibility as a barrier material for thermal and sealant materials

Narrow-gap flip chip underfill composition

Narrow-gap flip chip underfill composition

Methods to prevent filler entrapment in microelectronic device to microelectronic substrate interconnection structures

Methods to prevent filler entrapment in microelectronic device to microelectronic substrate interconnection structures

Stiffener tape for electronic assembly

Mold compound with reinforced fibers

Methods of promoting adhesion between underfill and conductive bumps and structures formed thereby

Robust ink formulations for durable markings on microelectronic packages and its extendibility as a barrier material for thermal and sealant materials

Methods of forming wafer level underfill materials and structures formed thereby

NOKIA MOBILE PHONES LTD

Exchange of system and terminal capabilities over the same analog control channel

Dual mode network call forwarding activation and deactivation

Dual mode network call forwarding activation and deactivation

NOKIA CORP

System, mobile station and method for delivering services

System and associated terminal, method and computer program product for directional channel browsing of broadcast content

BAI YIQUN

Methods of promoting adhesion between underfill and conductive bumps and structures formed thereby