P

Inventor

LEE GI SUB

KR5 patents
⚠️ This page may combine multiple inventors who share the name “LEE GI SUB”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRO MECH

3 patents
US11670452B2Jun 6, 2023

Multilayer electronic component

SAMSUNG ELECTRO MECH0 citations56
US9142499B2Sep 22, 2015

Lead pin for package substrate

SAMSUNG ELECTRO MECH0 citations49
US11869718B2Jan 9, 2024

Multilayer capacitor and board having the same mounted thereon

SAMSUNG ELECTRO MECH0 citations45

LEE DONG GYU

1 patent
US8822841B2Sep 2, 2014

Package substrate and fabricating method thereof

LEE DONG GYU2 citations60

LEE KI TAEK

1 patent
US8766450B2Jul 1, 2014

Lead pin for package substrate

LEE KI TAEK0 citations43