Inventor
BOWLES PHILIP H
US23 patents
⚠️ This page may combine multiple inventors who share the name “BOWLES PHILIP H”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
BOWLES PHILIP H
12 patentsUS9499397B2Nov 22, 2016
Microelectronic packages having axially-partitioned hermetic cavities and methods for the fabrication thereof
BOWLES PHILIP H49 citations97
US9108841B1Aug 18, 2015
Microelectronic packages having stacked accelerometer and magnetometer die and methods for the production thereof
BOWLES PHILIP H23 citations92
US8659167B1Feb 25, 2014
Sensor packaging method and sensor packages
BOWLES PHILIP H11 citations83
US9018029B1Apr 28, 2015
Vent hole sealing in multiple die sensor device
BOWLES PHILIP H4 citations73
US9365414B2Jun 14, 2016
Sensor package having stacked die
BOWLES PHILIP H4 citations72
US8709868B2Apr 29, 2014
Sensor packages and method of packaging dies of differing sizes
BOWLES PHILIP H4 citations72
US9090454B2Jul 28, 2015
Sequential wafer bonding
BOWLES PHILIP H2 citations62
US9040355B2May 26, 2015
Sensor package and method of forming same
BOWLES PHILIP H3 citations62
US10442685B2Oct 15, 2019
Microelectronic packages having hermetic cavities and methods for the production thereof
BOWLES PHILIP H0 citations51
US9604844B2Mar 28, 2017
Sequential wafer bonding
BOWLES PHILIP H0 citations51
US8884413B2Nov 11, 2014
Leadframes, air-cavity packages, and electronic devices with offset vent holes, and methods of their manufacture
BOWLES PHILIP H0 citations51
US9891244B2Feb 13, 2018
Microelectronic packages having split gyroscope structures and methods for the fabrication thereof
BOWLES PHILIP H0 citations41
FREESCALE SEMICONDUCTOR INC
7 patentsUS10053359B2Aug 21, 2018
Microelectronic packages having axially-partitioned hermetic cavities and methods for the fabrication thereof
FREESCALE SEMICONDUCTOR INC35 citations94
US7446017B2Nov 4, 2008
Methods and apparatus for RF shielding in vertically-integrated semiconductor devices
FREESCALE SEMICONDUCTOR INC46 citations92
US9165886B2Oct 20, 2015
Sensor packaging method and sensor packages
FREESCALE SEMICONDUCTOR INC15 citations84
US7723224B2May 25, 2010
Microelectronic assembly with back side metallization and method for forming the same
FREESCALE SEMICONDUCTOR INC7 citations70
US9376310B2Jun 28, 2016
Microelectronic packages having stacked accelerometer and magnetometer die and methods for the production thereof
FREESCALE SEMICONDUCTOR INC2 citations62
US9227838B2Jan 5, 2016
Cavity-type semiconductor package and method of packaging same
FREESCALE SEMICONDUCTOR INC2 citations62
US9359192B1Jun 7, 2016
Microelectromechanical systems (MEMS) devices with control circuits and methods of fabrication
FREESCALE SEMICONDUCTOR INC0 citations38