Inventor
SARIHAN VIJAY
US13 patents
⚠️ This page may combine multiple inventors who share the name “SARIHAN VIJAY”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
FREESCALE SEMICONDUCTOR INC
7 patentsUS7145084B1Dec 5, 2006
Radiation shielded module and method of shielding microelectronic device
FREESCALE SEMICONDUCTOR INC45 citations92
US6930032B2Aug 16, 2005
Under bump metallurgy structural design for high reliability bumped packages
FREESCALE SEMICONDUCTOR INC43 citations92
US6888246B2May 3, 2005
Semiconductor power device with shear stress compensation
FREESCALE SEMICONDUCTOR INC22 citations92
US9548280B2Jan 17, 2017
Solder pad for semiconductor device package
FREESCALE SEMICONDUCTOR INC3 citations73
US9818712B2Nov 14, 2017
Package with low stress region for an electronic component
FREESCALE SEMICONDUCTOR INC1 citations52
US9458012B2Oct 4, 2016
Method for shielding MEMS structures during front side wafer dicing
FREESCALE SEMICONDUCTOR INC0 citations41
US9359192B1Jun 7, 2016
Microelectromechanical systems (MEMS) devices with control circuits and methods of fabrication
FREESCALE SEMICONDUCTOR INC0 citations38
MOTOROLA INC
4 patentsUS6646347B2Nov 11, 2003
Semiconductor power device and method of formation
MOTOROLA INC137 citations98
US6077726AJun 20, 2000
Method and apparatus for stress relief in solder bump formation on a semiconductor device
MOTOROLA INC225 citations96
US5515735AMay 14, 1996
Micromachined flow sensor device using a pressure difference and method of manufacturing the same
MOTOROLA INC46 citations92
US6309908B1Oct 30, 2001
Package for an electronic component and a method of making it
MOTOROLA INC25 citations90