Inventor

FARQUHAR DONALD S

US52 patents

⚠️ This page may combine multiple inventors who share the name “FARQUHAR DONALD S”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

FARQUHAR DONALD S

IBM

Multi-layered interconnect structure using liquid crystalline polymer dielectric

Method and structure for producing Z-axis interconnection assembly of printed wiring board elements

Method of making and interconnect structure

Tamper-responding encapsulated enclosure having flexible protective mesh structure

Thin film attachment to laminate using a dendritic interconnection

Tamper-responding encapsulated enclosure having flexible protective mesh structure

Electronic package with high density interconnect layer

Multi-layered interconnect structure using liquid crystalline polymer dielectric

Z-interconnections with liquid crystal polymer dielectric films

High performance packaging platform and method of making same

Method and structure for producing Z-axis interconnection assembly of printed wiring board elements

Formation of multisegmented plated through holes

Formation of multisegmented plated through holes

Semiconductor device having a thermoset-containing dielectric material and methods for fabricating the same

Method of making a multi-layered interconnect structure

Method and structure for producing Z-axis interconnection assembly of printed wiring board elements

Solid via layer to layer interconnect

Flip chip package with improved cap design and process for making thereof

Method of making a printed circuit board having filled holes and a fill member for use therewith including reinforcement means

Method of making a printed circuit board having filled holes and fill member for use therewith

Practical method to make blind vias in circuit boards and other substrates

Circuit package having low modulus, conformal mounting pads

Security cloth design and assembly

Security cloth design and assembly

Method and apparatus for improved fold retention on a security enclosure

Electronic package with optimized lamination process

Platen for use in laminating press

Electronic package having an adhesive retaining cavity

Multi-layered interconnect structure using liquid crystalline polymer dielectric

Solid via layer to layer interconnect

Formation of multisegmented plated through holes

Lamination of liquid crystal polymer dielectric films

Interconnect structure and method of making same

Method and article for filling apertures in a high performance electronic substrate

Hole fill composition and method for filling holes in a substrate

Substrate having high optical contrast and method of making same

Method of forming metallic z-interconnects for laminate chip packages and boards

Method and structure for producing Z-axis interconnection assembly of printed wiring board elements

Patterning a layered chrome-copper structure disposed on a dielectric substrate

Multi-layered interconnect structure using liquid crystalline polymer dielectric

Method and structure for producing Z-axis interconnection assembly of printed wiring board elements

Semiconductor device having a thermoset-containing dielectric material and methods for fabricating the same

Lamination of liquid crystal polymer dielectric films

Semiconductor device having a thermoset-containing dielectric material and methods for fabricating the same

Method for producing Z-axis interconnection assembly of printed wiring board elements

Accelerated etching of chromium

Method of making a printed circuit board having filled holes and a fill member for use therewith including reinforcement means

Electronic package with optimized lamination process

Z-interconnections with liquid crystal polymer dielectric films

GEN ELECTRIC

Tri-stable flexure mechanism