Inventor
KLODOWSKI MICHAEL J
US5 patents
Patents
5 patentsUS7059049B2Jun 13, 2006
Electronic package with optimized lamination process
IBM15 citations82
US6395998B1May 28, 2002
Electronic package having an adhesive retaining cavity
IBM18 citations81
US6335495B1Jan 1, 2002
Patterning a layered chrome-copper structure disposed on a dielectric substrate
IBM11 citations72
US6843929B1Jan 18, 2005
Accelerated etching of chromium
IBM3 citations61
US7329816B2Feb 12, 2008
Electronic package with optimized lamination process
IBM2 citations60