Inventor
QUESTAD DAVID
US8 patents
⚠️ This page may combine multiple inventors who share the name “QUESTAD DAVID”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
6 patentsUS7059049B2Jun 13, 2006
Electronic package with optimized lamination process
IBM15 citations82
US7855430B2Dec 21, 2010
Electronic components on trenched substrates and method of forming same
IBM4 citations73
US7777301B2Aug 17, 2010
Electronic components on trenched substrates and method of forming same
IBM4 citations73
US8054630B2Nov 8, 2011
Electronic components on trenched substrates and method of forming same
IBM6 citations72
US7732894B2Jun 8, 2010
Electronic components on trenched substrates and method of forming same
IBM4 citations72
US7329816B2Feb 12, 2008
Electronic package with optimized lamination process
IBM2 citations60