Inventor
HAN WEIMIN
US6 patents
⚠️ This page may combine multiple inventors who share the name “HAN WEIMIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
5 patentsUS11276760B2Mar 15, 2022
Non-planar semiconductor device having omega-fin with doped sub-fin region and method to fabricate same
INTEL CORP2 citations72
US6140251AOct 31, 2000
Method of processing a substrate
INTEL CORP9 citations72
US12550698B2Feb 10, 2026
Via profile shrink for advanced integrated circuit structure fabrication
INTEL CORP0 citations54
US10355093B2Jul 16, 2019
Non-planar semiconductor device having omega-fin with doped sub-fin region and method to fabricate same
INTEL CORP0 citations51
US11482433B2Oct 25, 2022
Stacked thermal processing chamber modules for remote radiative heating in semiconductor device manufacture
INTEL CORP0 citations39