Inventor

ROY MIHIR

US7 patents

⚠️ This page may combine multiple inventors who share the name “ROY MIHIR”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

QORVO US INC

4 patents

US12087656B2Sep 10, 2024

MALLIK DEBENDRA

1 patent

US9210809B2Dec 8, 2015

Reduced PTH pad for enabling core routing and substrate layer count reduction

MALLIK DEBENDRA37 citations95

ROY MIHIR

1 patent

US8227706B2Jul 24, 2012

Coaxial plated through holes (PTH) for robust electrical performance

ROY MIHIR12 citations76

INTEL CORP

1 patent

US9711441B2Jul 18, 2017

Reduced PTH pad for enabling core routing and substrate layer count reduction

INTEL CORP0 citations51

ROY MIHIR

QORVO US INC

Package architecture utilizing wafer to wafer bonding

Package architecture utilizing wafer to wafer bonding

System in package with flip chip die over multi-layer heatsink stanchion

System in package with flip chip die over multi-layer heatsink stanchion

MALLIK DEBENDRA

Reduced PTH pad for enabling core routing and substrate layer count reduction

ROY MIHIR

Coaxial plated through holes (PTH) for robust electrical performance

INTEL CORP

Reduced PTH pad for enabling core routing and substrate layer count reduction