Inventor
TAMURA KOKI
JP23 patents
⚠️ This page may combine multiple inventors who share the name “TAMURA KOKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TOKYO OHKA KOGYO CO LTD
14 patentsUS7371510B2May 13, 2008
Material for forming resist protecting film for use in liquid immersion lithography process, composite film, and method for forming resist pattern
TOKYO OHKA KOGYO CO LTD44 citations92
US9308715B2Apr 12, 2016
Laminate and method for separating the same
TOKYO OHKA KOGYO CO LTD10 citations84
US9881829B2Jan 30, 2018
Adhesive composition, laminate, and stripping method
TOKYO OHKA KOGYO CO LTD2 citations72
US7416832B2Aug 26, 2008
Positive resist composition
TOKYO OHKA KOGYO CO LTD4 citations60
US7318992B2Jan 15, 2008
Lift-off positive resist composition
TOKYO OHKA KOGYO CO LTD6 citations60
US7261994B2Aug 28, 2007
Positive resist composition
TOKYO OHKA KOGYO CO LTD4 citations60
US9352542B2May 31, 2016
Processing method and processing apparatus
TOKYO OHKA KOGYO CO LTD2 citations57
US9017932B2Apr 28, 2015
Processed substrate and method for manufacturing same
TOKYO OHKA KOGYO CO LTD1 citations52
US8809457B2Aug 19, 2014
Adhesive composition, adhesive film, and method for treating substrate
TOKYO OHKA KOGYO CO LTD0 citations52
US8357750B2Jan 22, 2013
Adhesive composition and film adhesive
TOKYO OHKA KOGYO CO LTD1 citations52
US8354157B2Jan 15, 2013
Support plate, method for producing the same, and method for processing substrate
TOKYO OHKA KOGYO CO LTD0 citations52
US9607875B2Mar 28, 2017
Adhesive composition, laminate, and stripping method
TOKYO OHKA KOGYO CO LTD1 citations51
US10793756B2Oct 6, 2020
Adhesive composition, adhesive film, and bonding method
TOKYO OHKA KOGYO CO LTD0 citations41
US9944049B2Apr 17, 2018
Composition for forming release layer, release layer, laminate including release layer, method of preparing laminate, and method of treating laminate
TOKYO OHKA KOGYO CO LTD0 citations41