Inventor
IWATA YASUMASA
JP16 patents
⚠️ This page may combine multiple inventors who share the name “IWATA YASUMASA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TOKYO OHKA KOGYO CO LTD
9 patentsUS8882096B2Nov 11, 2014
Perforated support plate
TOKYO OHKA KOGYO CO LTD7 citations83
US9881829B2Jan 30, 2018
Adhesive composition, laminate, and stripping method
TOKYO OHKA KOGYO CO LTD2 citations72
US9627235B2Apr 18, 2017
Supporting member separation method
TOKYO OHKA KOGYO CO LTD4 citations72
US9682541B2Jun 20, 2017
Bonding method
TOKYO OHKA KOGYO CO LTD0 citations51
US9607875B2Mar 28, 2017
Adhesive composition, laminate, and stripping method
TOKYO OHKA KOGYO CO LTD1 citations51
US8371317B2Feb 12, 2013
Surface treatment apparatus
TOKYO OHKA KOGYO CO LTD0 citations50
US8377256B2Feb 19, 2013
Stripping device and stripping method
TOKYO OHKA KOGYO CO LTD1 citations49
US10607876B2Mar 31, 2020
Method for processing mold material and method for manufacturing structural body
TOKYO OHKA KOGYO CO LTD0 citations41
US9484238B2Nov 1, 2016
Attachment method
TOKYO OHKA KOGYO CO LTD0 citations41
NAKAMURA AKIHIKO
4 patentsUS8167687B2May 1, 2012
Method of thinning wafer and support plate
NAKAMURA AKIHIKO3 citations62
US8186410B2May 29, 2012
Separating device
NAKAMURA AKIHIKO2 citations61
US8449691B2May 28, 2013
Liquid solvent abutment unit
NAKAMURA AKIHIKO1 citations51
US8181660B2May 22, 2012
Treatment liquid permeation unit and treating apparatus
NAKAMURA AKIHIKO1 citations50