Inventor
LIU HSICHANG
US18 patents
⚠️ This page may combine multiple inventors who share the name “LIU HSICHANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
15 patentsUS7369410B2May 6, 2008
Apparatuses for dissipating heat from semiconductor devices
IBM101 citations96
US5935404AAug 10, 1999
Method of performing processes on features with electricity
IBM7 citations71
US6348233B2Feb 19, 2002
Method of forming conductive line features for enhanced reliability of multi-layer ceramic substrates
IBM7 citations69
US6217989B1Apr 17, 2001
Conductive line features for enhanced reliability of multi-layer ceramic substrates
IBM6 citations69
US6838009B2Jan 4, 2005
Rework method for finishing metallurgy on chip carriers
IBM6 citations62
US7078320B2Jul 18, 2006
Partial wafer bonding and dicing
IBM2 citations60
US5985128ANov 16, 1999
Method of performing processes on features with electricity
IBM2 citations60
US7836935B2Nov 23, 2010
Apparatus for providing uniaxial load distribution for laminate layers of multilayer ceramic chip carriers
IBM3 citations58
US7287468B2Oct 30, 2007
Nickel alloy plated structure
IBM3 citations58
US7302757B2Dec 4, 2007
Micro-bumps to enhance LGA interconnections
IBM6 citations54
US6662718B2Dec 16, 2003
Screening mask having a stress-relieving area
IBM2 citations53
US8910853B2Dec 16, 2014
Additives for grain fragmentation in Pb-free Sn-based solder
IBM0 citations51
US7947143B2May 24, 2011
Method for providing uniaxial load distribution for laminate layers of multilayer ceramic chip carriers
IBM0 citations48
US7472650B2Jan 6, 2009
Nickel alloy plated structure
IBM1 citations48
US7683493B2Mar 23, 2010
Intermetallic diffusion block device and method of manufacture
IBM0 citations46