Inventor
SALIMENO III JAMES R
US4 patents
Patents
4 patentsUS7078320B2Jul 18, 2006
Partial wafer bonding and dicing
IBM2 citations60
US7230335B2Jun 12, 2007
Inspection methods and structures for visualizing and/or detecting specific chip structures
IBM1 citations50
US10571490B2Feb 25, 2020
Solder bump array probe tip structure for laser cleaning
IBM0 citations48
US9835653B2Dec 5, 2017
Solder bump array probe tip structure for laser cleaning
IBM0 citations48